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NTS4172N Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET 30 V, 1.7 A, Single N−Channel, SC−70 | |||
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NTS4172N
Power MOSFET
30 V, 1.7 A, Single NâChannel, SCâ70
Features
⢠Low OnâResistance
⢠Low Gate Threshold Voltage
⢠Halide Free
⢠This is a PbâFree Device
Applications
⢠Low Side Load Switch
⢠DCâDC Converters (Buck and Boost Circuits)
⢠Optimized for Battery and Load Management Applications in
Portable Equipment like Cell Phones, PDAâs, Media Players, etc.
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
DrainâtoâSource Voltage
VDSS
30
V
GateâtoâSource Voltage
VGS
±12
V
Continuous Drain
Current (Note 1)
Steady TA = 25°C
State TA = 85°C
ID
1.6
1.13
A
t ⤠5 s TA = 25°C
1.70
Power Dissipation
(Note 1)
Steady
State
TA = 25°C
PD
tâ¤5s
0.294
W
0.350
Pulsed Drain Current
tp = 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8â³ from case for 10 s)
IDM
3.4
A
TJ,
Tstg
â55 to
150
°C
IS
0.25
A
TL
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
JunctionâtoâAmbient â Steady State (Note 1)
RqJA
425 °C/W
JunctionâtoâAmbient â t ⤠5 s (Note 1)
RqJA
360
1. Surfaceâmounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces)
http://onsemi.com
V(BR)DSS
30 V
RDS(on) MAX
93 mW @ 10 V
100 mW @ 4.5 V
140 mW @ 2.5 V
ID MAX
1.7 A
1.5 A
1.0 A
SCâ70/SOTâ323 (3 LEADS)
D
G
S
3
MARKING DIAGRAM/
PIN ASSIGNMENT
1
2
SCâ70/SOTâ323
CASE 419
STYLE 8
3 Drain
TFMG
G
1
Gate
2
Source
TF
= Specific Device Code
M
= Date Code*
G
= PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shippingâ
NTS4172NT1G SCâ70 3000/Tape & Reel
(PbâFree)
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
* Date code orientation may vary depending upon
manufacturing location
© Semiconductor Components Industries, LLC, 2008
1
June, 2008 â Rev. 0
Publication Order Number:
NTS4172N/D
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