NTS4101P_06 Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET -20 V, -1.37 A, Single P-Channel, SC-70

NTS4101P
Power MOSFET
−20 V, −1.37 A, Single P−Channel, SC−70
Features
• Leading −20 V Trench for Low R_DS(on)
• −2.5 V Rated for Low Voltage Gate Drive
• SC−70 Surface Mount for Small Footprint (2x2 mm)
• Pb−Free Package is Available
Applications
• High Side Load Switch
• Charging Circuit
• Single Cell Battery Applications such as: Cell Phones,
Digital Cameras, PDAs
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Steady
State
Steady
State
T_A = 25°C
T_A = 70°C
T_A = 25°C
V_DSS
V_GS
I_D
P_D
−20
±8
−1.37
−0.62
0.329
Pulsed Drain Current
t_p = 10 ms
Operating Junction and Storage Temperature
I_DM
T_J,
T_STG
−4.0
−55 to
150
Source Current (Body Diode), Continuous
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I_S
−0.5
T_L
260
Units
V
V
A
W
A
°C
A
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Units
Junction−to−Ambient – Steady State (Note 1)
R_qJA
380 °C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
http://onsemi.com
V_(BR)DSS
−20 V
R_DS(on) Typ
83 mW @ −4.5 V
88 mW @ −3.6 V
104 mW @ −2.5 V
I_D Max
−1.37 A
P−Channel MOSFET
S
G
D
3
1
2
SC−70/SOT−323
CASE 419
STYLE 8
MARKING DIAGRAM &
PIN ASSIGNMENT
D
3
TT M G
G
1
2
G
S
TT
= Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
NTS4101PT1 SOT−323 3000/Tape & Reel
NTS4101PT1G
SOT−323
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 206
1
March, 2006 − Rev. 2
Publication Order Number:
NTS4101P/D