NTR4170N Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET 30 V, 3.2 A, Single N−Channel, SOT−23

NTR4170N
Power MOSFET
30 V, 3.2 A, Single N−Channel, SOT−23
Features
• Low R_DS(on)
• Low Gate Charge
• Low Threshold Voltage
• Halide Free
• This is a Pb−Free Device
Applications
• Power Converters for Portables
• Battery Management
• Load/Power Switch
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
30
V
Gate−to−Source Voltage
V_GS
±12
V
Continuous Drain
Current (Note 1)
T_A = 25°C
t ≤ 30 s
T_A = 85°C
I_D
3.2
2.3
A
t ≤ 10 s T_A = 25°C
4.0
Power Dissipation
(Note 1)
Steady
State
T_A = 25°C
P_D
t ≤ 10 s
0.78
W
1.25
Pulsed Drain Current
t_p = 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I_DM
8.0
A
T_J,
T_stg
−55 to
150
°C
I_S
0.78 A
T_L
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Ambient − Steady State (Note 1)
R_qJA
260 °C/W
Junction−to−Ambient − t ≤ 30 s
R_qJA
153
Junction−to−Ambient − t < 10 s (Note 1)
R_qJA
100
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
http://onsemi.com
V_(BR)DSS
30 V
R_DS(on) MAX
55 mW @ 10 V
70 mW @ 4.5 V
110 mW @ 2.5 V
I_D MAX
3.2 A
2.8 A
2.0 A
SIMPLIFIED SCHEMATIC − N−CHANNEL
D
G
S
3
1
2
SOT−23
CASE 318
STYLE 21
MARKING DIAGRAM/
PIN ASSIGNMENT
3
Drain
TREMG
G
1
1
Gate
2
Source
TRE = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
NTR4170NT1G
Package
SOT−23
(Pb−Free)
Shipping^†
3000/Tape & Reel
NTR4170NT3G SOT−23 10000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2008
1
June, 2008 − Rev. 0
Publication Order Number:
NTR4170N/D