NTR3C21NZ_16 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET

NTR3C21NZ
Power MOSFET
20 V, 3.6 A, Single N−Channel
2.4 x 2.9 x 1.0 mm SOT−23 Package
Features
• Advanced Trench Technology
• Ultra−Low R_DS(on) in SOT−23 Package
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Power Load Switch
• Power Management
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
20
V
Gate−to−Source Voltage
V_GS
±8
V
Continuous Drain Current Steady T_A = 25°C
I_D
(Note 1)
State
T_A = 85°C
3.6
A
2.6
t ≤ 5 s T_A = 25°C
6.5
Power Dissipation
(Note 1)
Steady T_A = 25°C P_D
State
0.47 W
t≤5s
1.56
Pulsed Drain Current
t_p = 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8 in from case for 10 s)
I_DM
13.2 A
T_J, −55 to °C
T_STG
150
I_S
2.2
A
T_L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Ambient – Steady State (Note 1)
R_qJA
Junction−to−Ambient – t ≤ 5 s (Note 1)
R_qJA
1. Surface−mounted on FR4 board using 1 in sq. pad size
(Cu area = 1.127 in sq. [1 oz] including traces).
2. Pulse Test: pulse width ≤ 300 ms, duty cycle ≤ 2%.
264 °C/W
80
www.onsemi.com
V_(BR)DSS
20 V
R_DS(on) Max
24 mW @ 4.5 V
26 mW @ 3.7 V
29 mW @ 3.3 V
33 mW @ 2.5 V
55 mW @ 1.8 V
I_D MAX
3.6 A
N−Channel MOSFET
D3
G
1
S2
MARKING DIAGRAM &
PIN ASSIGNMENT
Drain
3
SOT−23
CASE 318
STYLE 21
TRY MG
G
1
Gate
2
Source
TRY = Specific Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
NTR3C21NZT1G SOT−23 3000 / Tape &
(Pb−Free)
Reel
NTR3C21NZT5G SOT−23 10,000 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
1
October, 2016 − Rev. 1
Publication Order Number:
NTR3C21NZ/D