NTR3162P Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET −20 V, −3.6 A, Single P−Channel, SOT−23

NTR3162P
Power MOSFET
−20 V, −3.6 A, Single P−Channel, SOT−23
Features
• Low R_DS(on) at Low Gate Voltage
• −0.3 V Low Threshold Voltage
• Fast Switching Speed
• This is a Pb−Free Device
Applications
• Battery Management
• Load Switch in PWM
• Battery Protection
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
−20
V
Gate−to−Source Voltage
V_GS
±8
V
Continuous Drain
Current (Note 1)
Steady ^{TA = 25°C}
State _{TA = 85°C}
I_D
−2.2
−1.6 A
t ≤ 5 s T_A = 25°C
−3.6
Power Dissipation
(Note 1)
Steady
State _{TA = 25°C}
P_D
t≤5s
0.48
W
1.25
Pulsed Drain Current
t_p = 10 ms
Operating Junction and Storage Temperature
I_DM
−10.7 A
T_J,
T_stg
−55 to
150
°C
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I_S
−0.6 A
T_L
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Ambient − Steady State (Note 1)
R_qJA
260 °C/W
Junction−to−Ambient − t < 10 s (Note 1)
R_qJA
100
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
http://onsemi.com
V_(BR)DSS
−20 V
R_DS(on) MAX
70 mW @ −4.5 V
95 mW @ −2.5 V
120 mW @ −1.8 V
I_D MAX
−2.2 A
−1.9 A
−1.7 A
SIMPLIFIED SCHEMATIC
Gate
Drain
Source
(Top View)
3
1
2
SOT−23
CASE 318
STYLE 21
MARKING DIAGRAM/
PIN ASSIGNMENT
3
Drain
TRDMG
G
1
1
Gate
2
Source
TRD = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
NTR3162PT1G SOT−23
(Pb−Free)
3000 /
Tape & Reel
NTR3162PT3G SOT−23
(Pb−Free)
10000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2008
1
May, 2008 − Rev. 0
Publication Order Number:
NTR3162P/D