NTR1P02T1G Datasheet, PDF (1/5 Pages) ON Semiconductor – −20 V, −1 A, P−Channel SOT−23 Package

NTR1P02T1, NVR1P02T1
Power MOSFET
−20 V, −1 A, P−Channel SOT−23 Package
Features
• Ultra Low On−Resistance Provides Higher Efficiency
and Extends Battery Life
R_DS(on) = 0.180 W, V_GS = −10 V
R_DS(on) = 0.280 W, V_GS = −4.5 V
• Power Management in Portable and Battery−Powered Products
• Miniature SOT−23 Surface Mount Package Saves Board Space
• Mounting Information for SOT−23 Package Provided
• AEC−Q101 Qualified and PPAP Capable − NVR1P02T1
• These Devices are Pb−Free and are RoHS Compliant
Applications
• DC−DC Converters
• Computers
• Printers
• PCMCIA Cards
• Cellular and Cordless Telephones
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Drain Current
− Continuous @ T_A = 25°C
− Pulsed Drain Current (t_p ≤ 1 ms)
Total Power Dissipation @ T_A = 25°C
Operating and Storage Temperature Range
V_DSS
V_GS
I_D
I_DM
P_D
T_J, T_stg
−20
V
±20
V
A
−1.0
−2.67
400 mW
− 55 to °C
150
Thermal Resistance; Junction−to−Ambient
Maximum Lead Temperature for Soldering
Purposes, (1/8″ from case for 10 s)
R_qJA
T_L
300 °C/W
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
V_(BR)DSS
−20 V
R_DS(on) TYP
148 mW @ −10 V
I_D MAX
−1.0 A
P−Channel
D
G
3
1
2
SOT−23
CASE 318
STYLE 21
S
MARKING DIAGRAM/
PIN ASSIGNMENT
3
Drain
P2 G
G
1
Gate
2
Source
P2 = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
NTR1P02T1G SOT−23 3000 / Tape & Reel
(Pb−Free)
NTR1P02T3G SOT−23 10000 / Tape & Reel
(Pb−Free)
NVR1P02T1G SOT−23 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
October, 2011 − Rev. 6
Publication Order Number:
NTR1P02T1/D