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NTR1P02 Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET
NTR1P02, NVR1P02
Power MOSFET
−20 V, −1 A, P−Channel SOT−23 Package
Features
• Ultra Low On−Resistance Provides Higher Efficiency
and Extends Battery Life
RDS(on) = 0.180 W, VGS = −10 V
RDS(on) = 0.280 W, VGS = −4.5 V
• Power Management in Portable and Battery−Powered Products
• Miniature SOT−23 Surface Mount Package Saves Board Space
• Mounting Information for SOT−23 Package Provided
• NVR Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
Applications
• DC−DC Converters
• Computers
• Printers
• PCMCIA Cards
• Cellular and Cordless Telephones
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Drain Current
− Continuous @ TA = 25°C
− Pulsed Drain Current (tp ≤ 1 ms)
Total Power Dissipation @ TA = 25°C
Operating and Storage Temperature Range
VDSS
VGS
ID
IDM
PD
TJ, Tstg
−20
V
±20
V
A
−1.0
−2.67
400 mW
− 55 to °C
150
Thermal Resistance; Junction−to−Ambient
Maximum Lead Temperature for Soldering
Purposes, (1/8″ from case for 10 s)
RqJA
TL
300 °C/W
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
www.onsemi.com
V(BR)DSS
−20 V
RDS(on) TYP
148 mW @ −10 V
ID MAX
−1.0 A
P−Channel
D
G
3
1
2
SOT−23
CASE 318
STYLE 21
S
MARKING DIAGRAM/
PIN ASSIGNMENT
3
Drain
P2 G
G
1
Gate
2
Source
P2 = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NTR1P02T1G SOT−23 3000 / Tape & Reel
(Pb−Free)
NTR1P02T3G SOT−23 10000 / Tape & Reel
(Pb−Free)
NVR1P02T1G SOT−23 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2002
1
October, 2016 − Rev. 8
Publication Order Number:
NTR1P02T1/D