English
Language : 

NTP18N06 Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET 15 A, 60 V, N−Channel TO−220 & D2PAK
NTP18N06, NTB18N06
Power MOSFET
15 A, 60 V, N−Channel TO−220 & D2PAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
N−Channel
Typical Applications
D
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
• Pb−Free Packages are Available
G
S
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Drain−to−Gate Voltage (RGS = 10 mW)
Gate−to−Source Voltage
− Continuous
− Non−Repetitive (tp v 10 ms)
Drain Current
− Continuous @ TC = 25°C
− Continuous @ TC = 100°C
− Single Pulse (tp v 10 ms)
Total Power Dissipation @ TC = 25°C
Derate above 25°C
VDSS
VDGR
VGS
60 Vdc
60 Vdc
Vdc
"20
"30
ID
15 Adc
ID
8.0 Adc
IDM
45
Apk
PD
48.4 W
0.32 W/°C
Operating and Storage Temperature Range
TJ, Tstg −55 to °C
+175
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 10 Vdc, VDS = 60 Vdc,
IL(pk) = 11 A, L = 1.0 mH, RG = 25 W)
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient
Maximum Lead Temperature for Soldering
Purposes, (1/8″ from case for 10 s)
EAS
61 mJ
RqJC
RqJA
TL
°C/W
3.1
72.5
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
http://onsemi.com
V(BR)DSS
60 V
RDS(on) TYP
90 mW @ 10 V
ID MAX
15 A
4
1
2
3
TO−220AB
CASE 221A
STYLE 5
4
12
3
D2PAK
CASE 418AA
STYLE 2
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
4
Drain
NTx18N06G
AYWW
1
Gate
3
Source
2
Drain
NTx
18N06G
AYWW
12 3
Gate Drain Source
NTx18N06
x
A
Y
WW
G
= Device Code
= B or P
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2005
1
August, 2005 − Rev. 4
Publication Order Number:
NTP18N06/D