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NTP18N06 Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET 15 A, 60 V, N−Channel TO−220 & D2PAK | |||
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NTP18N06, NTB18N06
Power MOSFET
15 A, 60 V, NâChannel TOâ220 & D2PAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
NâChannel
Typical Applications
D
⢠Power Supplies
⢠Converters
⢠Power Motor Controls
⢠Bridge Circuits
⢠PbâFree Packages are Available
G
S
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
DrainâtoâSource Voltage
DrainâtoâGate Voltage (RGS = 10 mW)
GateâtoâSource Voltage
â Continuous
â NonâRepetitive (tp v 10 ms)
Drain Current
â Continuous @ TC = 25°C
â Continuous @ TC = 100°C
â Single Pulse (tp v 10 ms)
Total Power Dissipation @ TC = 25°C
Derate above 25°C
VDSS
VDGR
VGS
60 Vdc
60 Vdc
Vdc
"20
"30
ID
15 Adc
ID
8.0 Adc
IDM
45
Apk
PD
48.4 W
0.32 W/°C
Operating and Storage Temperature Range
TJ, Tstg â55 to °C
+175
Single Pulse DrainâtoâSource Avalanche
Energy â Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 10 Vdc, VDS = 60 Vdc,
IL(pk) = 11 A, L = 1.0 mH, RG = 25 W)
Thermal Resistance
â JunctionâtoâCase
â JunctionâtoâAmbient
Maximum Lead Temperature for Soldering
Purposes, (1/8â³ from case for 10 s)
EAS
61 mJ
RqJC
RqJA
TL
°C/W
3.1
72.5
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
http://onsemi.com
V(BR)DSS
60 V
RDS(on) TYP
90 mW @ 10 V
ID MAX
15 A
4
1
2
3
TOâ220AB
CASE 221A
STYLE 5
4
12
3
D2PAK
CASE 418AA
STYLE 2
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
4
Drain
NTx18N06G
AYWW
1
Gate
3
Source
2
Drain
NTx
18N06G
AYWW
12 3
Gate Drain Source
NTx18N06
x
A
Y
WW
G
= Device Code
= B or P
= Assembly Location
= Year
= Work Week
= PbâFree Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2005
1
August, 2005 â Rev. 4
Publication Order Number:
NTP18N06/D
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