NTNS41006PZ Datasheet, PDF (1/6 Pages) ON Semiconductor – Small Signal MOSFET

NTNS41006PZ
Small Signal MOSFET
−30 V, −130 mA, Single P−Channel,
0.62 x 0.62 x 0.4 mm XLLGA3 Package
Features
• Single P−Channel MOSFET
• Ultra Small and Thin Package (0.62 x 0.62 x 0.4 mm)
• Low R_DS(on) Solution in 0.62 x 0.62 mm Package
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Small Signal Load Switch
• Analog Switch
• High Speed Interfacing
• Optimized for Power Management in Ultra Portable Products
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value
Units
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Steady
Current (Note 1)
State
Power Dissipa-
tion (Note 1)
t≤5s
Steady
State
T_A = 25°C
T_A = 85°C
T_A = 25°C
T_A = 25°C
V_DSS
V_GS
I_D
P_D
−30
V
±20
V
−137 mA
−99
−148
121 mW
t ≤ 5 s T_A = 25°C
Pulsed Drain Current
t_p = 10 ms
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
I_DM
T_J,
T_STG
I_S
T_L
140
−550 mA
-55 to °C
150
−137 mA
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Units
Junction-to-Ambient – Steady State (Note 1)
R_θJA
1035 °C/W
Junction-to-Ambient – t ≤ 5 s (Note 1)
R_θJA
895
1. Surface Mounted on FR4 Board using the minimum recommended pad size,
(or 2 mm²), 1 oz Cu.
2. Pulse Test: pulse width ≤ 300 ms, duty cycle ≤ 2%.
www.onsemi.com
V_(BR)DSS
−30 V
MOSFET
R_DS(on) MAX
4.0 W @ −10 V
7.0 W @ −4.5 V
I_D MAX
−130 mA
P−Channel MOSFET
D (3)
G (1)
S (2)
3
2
1
XLLGA3
CASE 713AA
MARKING
DIAGRAM
1
JM
J = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device
NTNS41006PZTCG
Package
XLLGA3
(Pb−Free)
Shipping^†
8000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2017
1
May, 2017 − Rev. 1
Publication Order Number:
NTNS41006PZ/D