NTNS3C94NZ_16 Datasheet, PDF (1/6 Pages) ON Semiconductor – Small Signal MOSFET

NTNS3C94NZ
Small Signal MOSFET
12 V, 384 mA, Single N−Channel,
0.62 x 0.62 x 0.4 mm XLLGA3 Package
Features
• Single N−Channel MOSFET
• Ultra Small and Thin Package (0.62 x 0.62 x 0.4 mm)
• Low R_DS(on) Solution in 0.62 x 0.62 mm Package
• 1.8 V Gate Voltage Rating
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Small Signal Load Switch
• Analog Switch
• High Speed Interfacing
• Optimized for Power Management in Ultra Portable Products
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value
Units
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Steady
Current (Note 1)
State
Power Dissipa-
tion (Note 1)
t≤5s
Steady
State
T_A = 25°C
T_A = 85°C
T_A = 25°C
T_A = 25°C
V_DSS
V_GS
I_D
P_D
12
V
±8
V
384
mA
277
413
120 mW
t ≤ 5 s T_A = 25°C
Pulsed Drain Current
t_p = 10 ms
Operating Junction and Storage
Temperature
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
I_DM
T_J,
T_STG
I_S
T_L
140
115
A
-55 to °C
150
157
mA
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Units
Junction-to-Ambient – Steady State (Note 1)
R_θJA
1040 °C/W
Junction-to-Ambient – t ≤ 5 s (Note 1)
R_θJA
900
1. Surface Mounted on FR4 Board using the minimum recommended pad size,
(or 2 mm²), 1 oz Cu.
2. Pulse Test: pulse width ≤ 300 ms, duty cycle ≤ 2%.
www.onsemi.com
V_(BR)DSS
12 V
MOSFET
R_DS(on) MAX
0.48 W @ 4.5 V
0.54 W @ 3.7 V
0.60 W @ 3.3 V
0.80 W @ 2.5 V
1.90 W @ 1.8 V
I_D MAX
384 mA
N−Channel MOSFET
D (3)
G (1)
S (2)
MARKING
DIAGRAM
3
2
1
XLLGA3
CASE 713AE
1
EM
E = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device
NTNS3C94NZT5G
Package
XLLGA3
(Pb−Free)
Shipping^†
8000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
1
December, 2016 − Rev. 1
Publication Order Number:
NTNS3C94NZ/D