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NTNS3A65PZ Datasheet, PDF (1/6 Pages) ON Semiconductor – −20 V, −281 mA, Single P−Channel, SOT−883 (XDFN3) 1.0 x 0.6 x 0.4 mm Package | |||
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NTNS3A65PZ
Small Signal MOSFET
â20 V, â281 mA, Single PâChannel,
SOTâ883 (XDFN3) 1.0 x 0.6 x 0.4 mm
Package
Features
⢠Single PâChannel MOSFET
⢠Ultra Low Profile SOTâ883 (XDFN3) 1.0 x 0.6 x 0.4 mm for
Extremely Thin Environments Such as Portable Electronics
⢠Low RDS(on) Solution in the Ultra Small 1.0 x 0.6 mm Package
⢠1.5 V Gate Drive
⢠These Devices are PbâFree, Halogen Free/BFR Free and are RoHS
Compliant
Applications
⢠High Side Switch
⢠High Speed Interfacing
⢠Optimized for Power Management in Ultra Portable Solutions
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
DrainâtoâSource Voltage
GateâtoâSource Voltage
Continuous Drain
Current (Note 1)
Steady
State
Power Dissipation
(Note 1)
tâ¤5s
Steady
State
TA = 25°C
TA = 85°C
TA = 25°C
TA = 25°C
VDSS
VGS
ID
PD
â20
V
±8
V
â281 mA
â202
â332
155 mW
tâ¤5s
218
Pulsed Drain
Current
tp = 10 ms
IDM
â842 mA
Operating Junction and Storage
Temperature
TJ, TSTG â55 to °C
150
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8â from case for 10 s)
IS
â130 mA
TL
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfaceâmounted on FR4 board using the minimum recommended pad size,
or 2 mm2, 1 oz Cu.
2. Pulse Test: pulse width ⤠300 ms, duty cycle ⤠2%
http://onsemi.com
V(BR)DSS
â20 V
RDS(on) MAX
1.3 W @ â4.5 V
2.0 W @ â2.5 V
3.4 W @ â1.8 V
4.5 W @ â1.5 V
ID Max
â281 mA
PâCHANNEL MOSFET
S (2)
G (1)
D (3)
MARKING
3
DIAGRAM
SOTâ883 (XDFN3)
21
CASE 506CB
65 M
65
= Specific Device Code
M
= Date Code
ORDERING INFORMATION
Device
Package
Shippingâ
NTNS3A65PZT5G SOTâ883 8000 / Tape &
(PbâFree)
Reel
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
1
September, 2012 â Rev. 0
Publication Order Number:
NTNS3A65PZ/D
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