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NTMS4920N Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET 30 V, 17 A, N−Channel, SO−8 | |||
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NTMS4920N
Power MOSFET
30 V, 17 A, NâChannel, SOâ8
Features
⢠Low RDS(on) to Minimize Conduction Losses
⢠Low Capacitance to Minimize Driver Losses
⢠Optimized Gate Charge to Minimize Switching Losses
⢠These Devices are PbâFree, Halogen Free/BFR Free and are RoHS
Compliant
Applications
⢠DCâDC Converters
⢠Points of Loads
⢠Power Load Switch
⢠Motor Controls
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
DrainâtoâSource Voltage
VDSS
30
V
GateâtoâSource Voltage
VGS
±20 V
Continuous Drain
Steady TA = 25°C
ID
Current RqJA (Note 1)
State TA = 70°C
14.1 A
11.3
Power Dissipation RqJA Steady TA = 25°C
PD
(Note 1)
State
1.46 W
Continuous Drain
Steady TA = 25°C
ID
Current RqJA (Note 2)
State TA = 70°C
Power Dissipation RqJA
(Note 2)
TA = 25°C
PD
10.6 A
8.5
0.82 W
Continuous Drain
Steady TA = 25°C
ID
Current RqJA, t v 10 s State
(Note 1)
TA = 70°C
17
A
13.6
Power Dissipation
Steady TA = 25°C
RqJA, t v 10 s(Note 1) State
Pulsed Drain Current
TA = 25°C, tp = 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse DrainâtoâSource Avalanche Energy
(TJ = 25°C, VDD = 30 V, VGS = 10 V,
IL = 18 Apk, L = 1.0 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8â³ from case for 10 s)
PD
2.12 W
IDM
136 A
TJ, â55 to °C
Tstg
150
IS
2.1 A
EAS
162 mJ
TL
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
JunctionâtoâAmbient â Steady State (Note 1)
RqJA
85.5 °C/W
JunctionâtoâAmbient â t v 10 s (Note 1)
RqJA
59
JunctionâtoâFoot (Drain)
RqJF
25
JunctionâtoâAmbient â Steady State (Note 2)
RqJA
152
1. Surfacemounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
2. Surfacemounted on FR4 board using the minimum recommended pad size.
© Semiconductor Components Industries, LLC, 2009
1
September, 2009 â Rev. 1
http://onsemi.com
V(BR)DSS
30 V
RDS(ON) MAX
4.3 mW @ 10 V
5.7 mW @ 4.5 V
ID MAX
17 A
NâChannel
D
G
S
1
SOâ8
CASE 751
STYLE 12
MARKING DIAGRAM/
PIN ASSIGNMENT
1
Source
8
Drain
Source
Drain
Source
Drain
Gate
Drain
Top View
4920N = Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
G
= PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shippingâ
NTMS4920NR2G SOâ8 2500/Tape & Reel
(PbâFree)
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NTMS4920N/D
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