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NTMS4800N Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET 30 V, 8 A, N−Channel, SOIC−8 | |||
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NTMS4800N
Power MOSFET
30 V, 8 A, NâChannel, SOICâ8
Features
⢠Low RDS(on) to Minimize Conduction Losses
⢠Low Capacitance to Minimize Driver Losses
⢠Optimized Gate Charge to Minimize Switching Losses
⢠SOICâ8 Surface Mount Package Saves Board Space
⢠This is a PbâFree Device
Applications
⢠DCâDC Converters
⢠Printers
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
DrainâtoâSource Voltage
VDSS
30
V
GateâtoâSource Voltage
Continuous Drain
Current RqJA (Note 1)
VGS
TA = 25°C
ID
TA = 70°C
±20 V
6.4
A
5.1
Power Dissipation RqJA
(Note 1)
TA = 25°C
PD
1.29 W
Continuous Drain
TA = 25°C
ID
Current RqJA (Note 2)
Steady TA = 70°C
4.9
A
3.9
Power Dissipation RqJA State TA = 25°C
PD
0.75 W
(Note 2)
Continuous Drain
Current RqJA, t < 10 s
(Note 1)
TA = 25°C
ID
TA = 70°C
8.0
A
6.4
Power Dissipation
RqJA, t < 10 s (Note 1)
TA = 25°C
Pulsed Drain Current
TA = 25°C, tp = 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse DrainâtoâSource Avalanche Energy
(TJ = 25°C, VDD = 30 V, VGS = 10 V,
IL = 11 Apk, L = 1.0 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8â³ from case for t = 10 s)
PD
2.0 W
IDM
32
A
TJ, â55 to °C
Tstg
+150
IS
2.0 A
EAS
60.5 mJ
TL
260 °C
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
JunctionâtoâAmbient â Steady State (Note 1)
RqJA
97 °C/W
JunctionâtoâAmbient â t < 10 s (Note 1)
RqJA
62.5
JunctionâtoâFoot (Drain)
RqJF
25
JunctionâtoâAmbient â Steady State (Note 2)
RqJA
167
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfaceâmounted on FR4 board using 1 in sq pad, 1 oz Cu
2. Surfaceâmounted on FR4 board using the minimum recommended pad size
© Semiconductor Components Industries, LLC, 2009
1
August, 2009 â Rev. 1
http://onsemi.com
V(BR)DSS
30 V
RDS(ON) MAX
20 mW @ 10 V
27 mW @ 4.5 V
ID MAX
8A
NâChannel
D
G
S
MARKING DIAGRAM/
PIN ASSIGNMENT
1
SOâ8
CASE 751
STYLE 12
1
Source
8
Drain
Source
Drain
Source
Drain
Gate
Drain
Top View
4800N = Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
G
= PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shippingâ
NTMS4800NR2G SOICâ8 2500/Tape & Reel
(PbâFree)
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NTMS4800N/D
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