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NTMS4705N Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET 30 V, 12 A, Single N-Channel, SO-8
NTMS4705N
Power MOSFET
30 V, 12 A, Single N-Channel, SO-8
Features
•ăLow RDS(on)
•ăLow Gate Charge
•ăStandard SO-8 Single Package
•ăPb-Free Package is Available
Applications
•ăNotebooks, Graphics Cards
•ăSynchronous Rectification
•ăHigh Side Switch
•ăDC-DC Converters
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain-to-Source Voltage
VDSS
30
V
Gate-to-Source Voltage
VGS
±20 V
Continuous Drain
Current (Note 1)
Steady TA = 25°C
ID
State
TA = 85°C
10
A
7.2
t v 10 s TA = 25°C
12
Power Dissipation
(Note 1)
Steady TA = 25°C
PD
1.52 W
State
t v 10 s
2.3
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady TA = 25°C
ID
State
TA = 85°C
7.4 A
5.3
TA = 25°C
PD
0.85 W
Pulsed Drain Current
tp = 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain-to-Source Avalanche Energy
(VDD = 25 V, VGS = 10 V, Peak IL = 7.5 A,
L = 10 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
IDM
36
A
TJ, -55 to °C
Tstg
150
IS
3.0 A
EAS
210 mJ
TL
260 °C
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
Junction-to-Ambient – Steady State (Note 1)
RqJA
82 °C/W
Junction-to-Ambient – t v 10 s (Note 1)
RqJA
55
Junction-to-Ambient – Steady State (Note 2)
RqJA
147
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface mounted on FR4 board using the minimum recommended pad size.
http://onsemi.com
V(BR)DSS
RDS(ON) TYP
30 V
8.0 mW @ 10 V
10.5 mW @ 4.5 V
ID MAX
(Note 1)
12 A
N-Channel
D
G
S
1
SO-8
CASE 751
STYLE 12
MARKING DIAGRAM/
PIN ASSIGNMENT
1
Source
8
Drain
Source
Drain
Source
Gate
Drain
Drain
Top View
4705N = Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NTMS4705NR2
SO-8 2500/Tape & Reel
NTMS4705NR2G SO-8 2500/Tape & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2007
1
October, 2007 - Rev. 3
Publication Order Number:
NTMS4705N/D