NTMS4404N Datasheet, PDF (1/6 Pages) ON Semiconductor – Single N−Channel Power MOSFET

NTMS4404N
Power MOSFET
30 V, 12 A, Single N−Channel, SO−8
Features
• High Density Power MOSFET with Ultra Low R_DS(on) for Higher
Efficiency
• Miniature SO−8 Surface Mount Package Saving Board Space
• I_DSS Specified at Elevated Temperature
• Diode Exhibits High Speed, Soft Recovery
Applications
• Power Management for Battery Power Products
• Portable Products
• Computers, Printers, PCMCIA Cards
• Cell Phones, Cordless Telephones
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
30
V
Gate−to−Source Voltage
V_GS
$20
V
Continuous Drain
Current (Note 1)
Steady T_A = 25°C
I_D
State _{TA = 70°C}
tp v10 s T_A = 25°C
9.6
A
7.6
12
Power Dissipation
(Note 1)
Steady State
tp v10 s
P_D
1.56 W
2.5
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady T_A = 25°C
I_D
State _{TA = 70°C}
T_A = 25°C
P_D
7.0
A
5.6
0.83 W
Pulsed Drain Current tp = 10 ms, DC = 2 %
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
Energy (V_DD = 20 V, V_GS = 5 V, I_PK = 7.25 A,
L = 19 mH, R_G = 25 W)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I_DM
T_J,
T_STG
I_S
E_AS
T_L
50
A
−55 to °C
150
6.0
A
500 mJ
260 °C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Ambient – Steady State (Note 1)
R_qJA
80 °C/W
Junction−to−Ambient – t = 1 0 s (Note 1)
R_qJA
50
Junction−to−Ambient – Steady State (Note 2)
R_qJA
150
1. Surface−mounted on FR4 board using 1 in sq. pad size
(Cu area = 1.127 in sq. [1 oz] including traces)
2. Surface−mounted on FR4 board using the minimum recommended pad
size (Cu area = 0.412 in sq.)
http://onsemi.com
V_(BR)DSS
30 V
R_DS(on) TYP
9.7 mW @ 10 V
15.5 mW @ 4.5 V
N−Channel
D
I_D MAX
12 A
G
S
1
SO−8
CASE 751
STYLE 12
MARKING DIAGRAM/
PIN ASSIGNMENT
1
Source
8
Drain
Source
Drain
Source
Drain
Gate
Drain
Top View
E4404N = Device Code
L
= Assembly Location
Y
= Year
WW = Work Week
ORDERING INFORMATION
Device
Package
Shipping^†
NTMS4404NR2
SO−8
2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
1
August, 2006 − Rev. 2
Publication Order Number:
NTMS4404N/D