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NTMS4404 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET | |||
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NTMS4404N
Power MOSFET
30 V, 12 A, Single NâChannel, SOâ8
Features
⢠High Density Power MOSFET with Ultra Low RDS(on) for Higher
Efficiency
⢠Miniature SOâ8 Surface Mount Package Saving Board Space
⢠IDSS Specified at Elevated Temperature
⢠Diode Exhibits High Speed, Soft Recovery
Applications
⢠Power Management for Battery Power Products
⢠Portable Products
⢠Computers, Printers, PCMCIA Cards
⢠Cell Phones, Cordless Telephones
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
DrainâtoâSource Voltage
VDSS
30
V
GateâtoâSource Voltage
VGS
$20
V
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Steady TA = 25°C
ID
State TA = 70°C
tp v10 s TA = 25°C
Steady State
PD
tp v10 s
9.6
A
7.6
12
1.56 W
2.5
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady TA = 25°C
ID
State TA = 70°C
TA = 25°C
PD
7.0
A
5.6
0.83 W
Pulsed Drain Current tp = 10 ms, DC = 2 %
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse DrainâtoâSource Avalanche
Energy (VDD = 20 V, VGS = 5 V, IPK = 7.25 A,
L = 19 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8â from case for 10 s)
IDM
TJ,
TSTG
IS
EAS
TL
50
A
â55 to °C
150
6.0
A
500 mJ
260 °C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
JunctionâtoâAmbient â Steady State (Note 1)
RqJA
80 °C/W
JunctionâtoâAmbient â t = 1 0 s (Note 1)
RqJA
50
JunctionâtoâAmbient â Steady State (Note 2)
RqJA
150
1. Surfaceâmounted on FR4 board using 1 in sq. pad size
(Cu area = 1.127 in sq. [1 oz] including traces)
2. Surfaceâmounted on FR4 board using the minimum recommended pad
size (Cu area = 0.412 in sq.)
http://onsemi.com
V(BR)DSS
30 V
RDS(on) TYP
9.7 mW @ 10 V
15.5 mW @ 4.5 V
ID MAX
12 A
NâChannel
D
G
S
1
SOâ8
CASE 751
STYLE 12
MARKING DIAGRAM/
PIN ASSIGNMENT
1
Source
8
Drain
Source
Drain
Source
Gate
Drain
Drain
Top View
E4404N = Device Code
L
= Assembly Location
Y
= Year
WW = Work Week
ORDERING INFORMATION
Device
Package
Shippingâ
NTMS4404NR2 SOâ8
2500/Tape & Reel
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2003
1
November, 2003 â Rev. 1
Publication Order Number:
NTMS4404N/D
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