NTMS4177P Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET -30 V, -11.4 A, P-Channel, SOIC-8

NTMS4177P
Power MOSFET
-30 V, -11.4 A, P-Channel, SOIC-8
Features
•ăLow R_DS(on) to Minimize Conduction Losses
•ăLow Capacitance to Minimize Driver Losses
•ăOptimized Gate Charge to Minimize Switching Losses
•ăSOIC-8 Surface Mount Package Saves Board Space
•ăThis is a Pb-Free Device
Applications
•ăLoad Switches
•ăNotebook PC's
•ăDesktop PC's
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Rating
Symbol Value Unit
Drain-to-Source Voltage
V_DSS
-30
V
Gate-to-Source Voltage
Continuous Drain
Current R_qJA (Note 1)
Power Dissipation
R_qJA (Note 1)
V_GS
T_A = 25°C
I_D
T_A = 70°C
T_A = 25°C
P_D
±20
V
-8.9
A
-7.1
1.52 W
Continuous Drain
T_A = 25°C
I_D
Current R_qJA (Note 2) _{Steady TA = 70°C}
Power Dissipation
R_qJA (Note 2)
State _{TA = 25°C}
P_D
-6.6
A
-5.3
0.84 W
Continuous Drain
Current R_qJA t < 10 s
(Note 1)
T_A = 25°C
I_D
-11.4 A
T_A = 70°C
-9.3
Power Dissipation
R_qJA t < 10 s (Note 1)
T_A = 25°C
P_D
2.5
W
Pulsed Drain Current
T_A = 25°C,
t_p = 10 ms
I_DM
-46
A
Operating Junction and Storage Temperature T_J, T_STG -55 to °C
+150
Source Current (Body Diode)
Single Pulse Drain-to-Source Avalanche
Energy T_J = 25°C, V_DD = 30 V, V_GS = 10 V,
I_L = 20 A_pk, L = 1.0 mH, R_G = 25 W
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
I_S
EAS
-2.1
A
200 mJ
T_L
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface-mounted on FR4 board using 1 inch sq pad size, 1 oz Cu.
2. Surface-mounted on FR4 board using the minimum recommended pad size.
http://onsemi.com
V_(BR)DSS
-30 V
R_DS(on) Max
12 mW @ -10 V
19 mW @ -4.5 V
I_D Max
-11.4 A
P-Channel
D
G
S
MARKING DIAGRAM
& PIN ASSIGNMENT
8
1
SOIC-8
CASE 751
STYLE 12
D DDD
8
4177P
AYWW
G
1
S SSG
4177P = Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb-Free Package
ORDERING INFORMATION
Device
Package
Shipping^†
NTMS4177PR2G SOIC-8 2500/Tape & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2008
1
March, 2008 - Rev. 0
Publication Order Number:
NTMS4177P/D