NTMFS4854NS Datasheet, PDF (1/7 Pages) ON Semiconductor – Single N−Channel Power MOSFET

NTMFS4854NS
SENSEFET^® Power MOSFET
25 V, 149 A, Single N−Channel, SO−8 FL
Features
• Accurate, Lossless Current Sensing
• Low R_DS(on) to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• CPU Power Delivery
• DC−DC Converters
• Low Side Switching
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current R_qJA
(Note 1)
V_DSS
25
V
V_GS
±16
V
T_A = 25°C
I_D
24.4
A
T_A = 85°C
17.6
Power Dissipation
R_qJA (Note 1)
T_A = 25°C
P_D
2.31
W
Continuous Drain
T_A = 25°C
ID
Current R_qJA
(Note 2)
Steady T_A = 85°C
State
Power Dissipation
T_A = 25°C
P_D
R_qJA (Note 2)
15.2
A
11
0.9
W
Continuous Drain
Current R_qJC
(Note 1)
T_C = 25°C
I_D
149
A
T_C = 85°C
107.5
Power Dissipation
R_qJC (Note 1)
T_C = 25°C
P_D
86.2
W
Pulsed Drain
Current
T_A = 25°C,
t_p = 10 ms
I_DM
298
A
Operating Junction and Storage
Temperature
T_J, T_STG −55 to °C
+150
Source Current (Body Diode)
Drain to Source DV/DT
I_S
dV/dt
71
A
6
V/ns
Single Pulse Drain−to−Source Avalanche
Energy (T_J = 25°C, V_DD = 30 V, V_GS = 10 V,
I_L = 20 A_pk, L = 1.0 mH, R_G = 25 W)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
EAS
T_L
200
mJ
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
http://onsemi.com
V_(BR)DSS
25 V
R_DS(ON) MAX
2.5 mW @ 10 V
3.9 mW @ 4.5 V
DRAIN
I_D MAX
149 A
119 A
GATE
Kelvin
SENSE SOURCE
1
SO−8 FLAT LEAD
CASE 506BQ
MARKING
DIAGRAM
D (Do Not Connect)
S
NC
S ^4854NS SENSE
S ^AYWZZ KELVIN
G
K1
D (Do Not Connect)
A
= Assembly Location
Y
= Year
W
= Work Week
ZZ
= Lot Traceability
ORDERING INFORMATION
Device
Package
Shipping^†
NTMFS4854NST1G SO−8 FL 1500 Tape / Reel
(Pb−Free)
NTMFS4854NST3G SO−8 FL 5000 Tape / Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
1
May, 2012 − Rev. 1
Publication Order Number:
NTMFS4854NS/D