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NTMFS4841NH Datasheet, PDF (1/7 Pages) ON Semiconductor – Power MOSFET 30 V, 59 A, Single N−Channel, SO−8FL | |||
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NTMFS4841NH
Power MOSFET
30 V, 59 A, Single NâChannel, SOâ8FL
Features
⢠Low RDS(on) to Minimize Conduction Losses
⢠Low Capacitance to Minimize Driver Losses
⢠Optimized Gate Charge to Minimize Switching Losses
⢠Low RG
⢠These are PbâFree Devices*
Applications
⢠Refer to Application Note AND8195/D
⢠CPU Power Delivery
⢠DCâDC Converters
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Sym-
bol
Value Unit
DrainâtoâSource Voltage
GateâtoâSource Voltage
Continuous Drain
Current RqJA
(Note 1)
VDSS
30
V
VGS
±20
V
TA = 25°C
ID
TA = 85°C
13.5
A
9.7
Power Dissipation
RqJA (Note 1)
Continuous Drain
Current RqJA
v10 s
TA = 25°C
PD
TA = 85°C
TA = 25°C
ID
TA = 85°C
2.16
W
1.1
21.8
A
15.7
Power Dissipation
TA = 25°C
PD
RqJA v10 s
Steady TA = 85°C
Continuous Drain
Current RqJA
(Note 2)
State TA = 25°C
ID
TA = 85°C
5.7
W
2.9
8.6
A
6.2
Power Dissipation
RqJA (Note 2)
Continuous Drain
Current RqJC
(Note 1)
TA = 25°C
PD
TA = 85°C
TC = 25°C
ID
TC = 85°C
0.87
W
0.45
59
A
42.5
Power Dissipation
RqJC (Note 1)
Pulsed Drain
Current
TC = 25°C
PD
TC = 85°C
tp =
TA = 25°C
IDM
10 ms
41.7
W
21.7
177
A
Operating Junction and Storage Temperature
Source Current (Body Diode)
Drain to Source dV/dt
TJ,
TSTG
IS
dV/dt
â55 to
+150
35
6
°C
A
V/ns
Single Pulse DrainâtoâSource Avalanche
Energy (VDD = 24 V, VGS = 10 V, IL = 25.6 A,
L = 0.3 mH, RG = 25 W)
EAS
98
mJ
Lead Temperature for Soldering Purposes
(1/8â from case for 10 s)
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfaceâmounted on FR4 board using 1 sqâin pad, 1 oz Cu.
2. Surfaceâmounted on FR4 board using the minimum recommended pad size.
© Semiconductor Components Industries, LLC, 2010
1
May, 2010 â Rev. 4
http://onsemi.com
V(BR)DSS
30 V
RDS(ON) MAX
7.0 mW @ 10 V
11.6 mW @ 4.5 V
ID MAX
59 A
D (5,6)
G (4)
S (1,2,3)
NâCHANNEL MOSFET
1
SOâ8 FLAT LEAD
CASE 488AA
STYLE 1
MARKING
DIAGRAM
D
S
D
S 4841NH
S AYWWG
G
G
D
D
A
= Assembly Location
Y
= Year
WW = Work Week
G
= PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
NTMFS4841NHT1G
Package
SOâ8FL
(PbâFree)
Shippingâ
1500 /
Tape & Reel
NTMFS4841NHT3G SOâ8FL
5000 /
(PbâFree) Tape & Reel
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our PbâFree strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting Tech-
niques Reference Manual, SOLDERRM/D.
Publication Order Number:
NTMFS4841NH/D
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