NTMFS4834N_12 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 30V 130A Single N-Channel, SO-8FL

NTMFS4834N
Power MOSFET
30 V, 130 A, Single N−Channel, SO−8FL
Features
• Low R_DS(on) to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• These are Pb−Free Devices
Applications
• Refer to Application Note AND8195/D
• CPU Power Delivery
• DC−DC Converters
• Low Side Switching
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
30
V
Gate−to−Source Voltage
V_GS
±20
V
Continuous Drain
Current R_qJA
(Note 1)
T_A = 25°C
I_D
T_A = 85°C
21
A
15
Power Dissipation
R_qJA (Note 1)
T_A = 25°C
P_D
2.31
W
Continuous Drain
T_A = 25°C
ID
Current R_qJA
(Note 2)
Steady TA = 85°C
State
Power Dissipation
T_A = 25°C
P_D
R_qJA (Note 2)
13
A
9.5
0.9
W
Continuous Drain
Current R_qJC
(Note 1)
T_C = 25°C
I_D
T_C = 85°C
130
A
93
Power Dissipation
R_qJC (Note 1)
T_C = 25°C
P_D
86.2
W
Pulsed Drain
Current
T_A = 25°C,
t_p = 10 ms
I_DM
260
A
Operating Junction and Storage
Temperature
T_J, T_STG −55 to °C
+150
Source Current (Body Diode)
Drain to Source DV/DT
I_S
dV/dt
71
A
6
V/ns
Single Pulse Drain−to−Source Avalanche
Energy (T_J = 25°C, V_DD = 30 V, V_GS = 10 V,
I_L = 32 A_pk, L = 1.0 mH, R_G = 25 W)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
EAS
T_L
512
mJ
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
http://onsemi.com
V_(BR)DSS
30 V
R_DS(ON) MAX
3.0 mW @ 10 V
4.0 mW @ 4.5 V
I_D MAX
130 A
D (5,6)
G (4)
S (1,2,3)
N−CHANNEL MOSFET
1
SO−8 FLAT LEAD
CASE 488AA
STYLE 1
MARKING
DIAGRAM
D
S
D
S ^4834N
S ^AYWZZ
G
D
D
A
= Assembly Location
Y
= Year
W
= Work Week
ZZ
= Lot Traceability
ORDERING INFORMATION
Device
Package
Shipping^†
NTMFS4834NT1G SO−8FL 1500 Tape / Reel
(Pb−Free)
NTMFS4834NT3G SO−8FL 5000 Tape / Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
1
May, 2012 − Rev. 6
Publication Order Number:
NTMFS4834N/D