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NTMFS4833NAT1G Datasheet, PDF (1/7 Pages) ON Semiconductor – Power MOSFET | |||
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NTMFS4833NA
Power MOSFET
30 V, 191 A, Single NâChannel, SOâ8FL
Features
⢠Low RDS(on) to Minimize Conduction Losses
⢠Low Capacitance to Minimize Driver Losses
⢠Optimized Gate Charge to Minimize Switching Losses
⢠These are PbâFree Devices
Applications
⢠CPU Power Delivery
⢠DCâDC Converters
⢠Low Side Switching
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
DrainâtoâSource Voltage
VDSS
30
V
GateâtoâSource Voltage
VGS
±20
V
Continuous Drain
Current RqJA
(Note 1)
TA = 25°C
ID
TA = 85°C
28
A
20.5
Power Dissipation
RqJA (Note 1)
TA = 25°C
PD
2.7
W
Continuous Drain
TA = 25°C
ID
Current RqJA
(Note 2)
Steady TA = 85°C
State
Power Dissipation
TA = 25°C
PD
RqJA (Note 2)
16
A
12
1.1
W
Continuous Drain
Current RqJC
(Note 1)
TC = 25°C
ID
TC = 85°C
191
A
138
Power Dissipation
RqJC (Note 1)
TC = 25°C
PD
113.6 W
Pulsed Drain
Current
TA = 25°C,
tp = 10 ms
IDM
288
A
Operating Junction and Storage
Temperature
TJ, TSTG â55 to °C
+150
Source Current (Body Diode) (Note 3)
Pulse Source Current (Body Diode) (Note 3)
Drain to Source dV/dt
IS
ISM
dV/dt
104
A
312
A
6
V/ns
Single Pulse DrainâtoâSource Avalanche
Energy (TJ = 25°C, VDD = 30 V, VGS = 10 V,
IL = 35 Apk, L = 1.0 mH, RG = 25 W)
EAS
612.5 mJ
Lead Temperature for Soldering Purposes
(1/8â³ from case for 10 s)
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfaceâmounted on FR4 board using 1 sqâin pad, 1 oz Cu.
2. Surfaceâmounted on FR4 board using the minimum recommended pad size
(Cu area = 50 mm2 [1 oz]).
3. Guaranteed by design.
http://onsemi.com
V(BR)DSS
30 V
RDS(ON) MAX
2.0 mW @ 10 V
3.0 mW @ 4.5 V
D (5)
ID MAX
191 A
G (4)
S (1,2,3)
NâCHANNEL MOSFET
1
SOâ8 FLAT LEAD
CASE 488AA
STYLE 1
MARKING
DIAGRAM
D
S
D
S 4833NA
S AYWZZ
G
D
D
A
= Assembly Location
Y
= Year
W
= Work Week
ZZ
= Lot Traceability
ORDERING INFORMATION
Device
Package
Shippingâ
NTMFS4833NAT1G SOâ8FL 1500/Tape &
(PbâFree)
Reel
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
1
August, 2013 â Rev. 0
Publication Order Number:
NTMFS4833NA/D
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