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NTMFS4747N Datasheet, PDF (1/7 Pages) ON Semiconductor – Single N-Channel Power MOSFET
NTMFS4747N
Power MOSFET
30 V, 44 A, Single N-Channel, SO-8 FL
Features
•ăLow RDS(on) to Minimize Conduction Losses
•ăLow Capacitance to Minimize Driver Losses
•ăOptimized Gate Charge to Minimize Switching Losses
•ăThese are Pb-Free Devices
Applications
•ăCPU Power Delivery
•ăDC-DC Converters
•ăLow Side Switching
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value
Drain-to-Source Voltage
VDSS
30
Gate-to-Source Voltage
VGS
20
Continuous Drain
Current RqJA
TA = 25°C
ID
9.7
TA = 85°C
7.0
Power Dissipation
RqJA
TA = 25°C
PD
2.2
Continuous Drain
TA = 25°C
ID
6.0
Current RqJA
Steady TA = 85°C
4.2
State
Power Dissipation
TA = 25°C
PD
0.9
RqJA
Continuous Drain
Current RqJC
TC = 25°C
ID
44
TC = 85°C
32
Power Dissipation
RqJC
TC = 25°C
PD
43.9
Pulsed Drain
Current
TA = 25°C,
tp = 10 ms
IDM
67
Operating Junction and Storage
Temperature
TJ, TSTG -55 to
+150
Unit
V
V
A
W
A
W
A
W
A
°C
Source Current (Body Diode)
Drain to Source DV/DT
Single Pulse Drain-to-Source Avalanche
Energy TJ = 25°C, VDD = 50 V, VGS = 10 V,
IL = 20 Apk, L = 1.0 mH, RG = 25 W
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
IS
dV/dt
EAS
TL
36
A
6.0 V/ns
200
mJ
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
V(BR)DSS
30 V
RDS(on) MAX
13 mW @ 10 V
17 mW @ 4.5 V
ID MAX
44 A
N-Channel
D
G
S
1
SO-8 FLAT LEAD
CASE 488AA
STYLE 1
MARKING
DIAGRAM
D
S
D
S 4747N
S AYWWG
G
G
D
D
4747N = Specific Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NTMFS4747NT1G SO-8 FL 1500 Tape & Reel
(Pb-Free)
NTMFS4747NT3G SO-8 FL 5000 Tape & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2007
1
July, 2007 - Rev. 3
Publication Order Number:
NTMFS4747N/D