NTMFS4709N Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 30 V, 94 A, Single N-Channel, SOIC-8 FL

NTMFS4709N
Power MOSFET
30 V, 94 A, Single N-Channel, SOIC-8 FL
Features
•ăLow R_DS(on) to Minimize Conduction Losses
•ăLow Capacitance to Minimize Driver Losses
•ăOptimized Gate Charge to Minimize Switching Losses
•ăThese are Pb-Free Devices
Applications
•ăVCORE Applications
•ăDC-DC Converters
•ăLow Side Switching
MAXIMUM RATINGS (T_J=25°C unless otherwise stated)
Rating
Symbol Value
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain
Current R_qJA
(Note 1)
V_DSS
30
V_GS
±20
T_A = 25°C
I_D
18
T_A = 85°C
13
Power Dissipation
R_qJA (Note 1)
T_A = 25°C
P_D
2.35
Continuous Drain
T_A = 25°C
I_D
11
Current R_qJA
(Note 2)
Steady ^TA ^{= 85°C}
8.0
State
Power Dissipation
T_A = 25°C
P_D
0.91
R_qJA (Note 2)
Continuous Drain
Current R_qJC
(Note 1)
T_C = 25°C
I_D
94
T_C = 85°C
68
Power Dissipation
R_qJC (Note 1)
Pulsed Drain Cur‐
rent
Current limited by
package
T_C = 25°C
P_D
T_A = 25°C,
t_p = 10 ms
T_A = 25°C
I_DM
I_DmaxPkg
62.5
140
140
Operating Junction and
Storage Temperature
Source Current (Body Diode)
Drain to Source
T_J,
T_STG
I_S
dV/dt
-55 to
+150
62.5
10
Single Pulse Drain-to-Source Avalanche
E_AS
450
Energy T_J = 25°C, V_DD = 50 V, V_GS = 10 V,
I_L = 30 A_pk, L = 1.0 mH, R_G = 25 W
Lead Temperature for Soldering Purposes
T_L
260
(1/8” from case for 10 s)
Unit
V
V
A
W
A
W
A
W
A
A
°C
A
V/ns
mJ
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface-mounted on FR4 board using 1 sq-in pad, 1 oz Cu.
2. Surface-mounted on FR4 board using the minimum recommended pad size.
http://onsemi.com
V_(BR)DSS
30 V
R_DS(on) Typ
2.85 mW @ 10 V
4.0 mW @ 4.5 V
I_D Max
94 A
N-Channel
D
G
S
MARKING DIAGRAM &
PIN ASSIGNMENT
1
SOIC-8 FLAT LEAD
CASE 488AA
STYLE 1
D
S
D
S 4709N
S AYWWĂG
G
G
D
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4709N
A
Y
WW
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= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
NTMFS4709NT1G SOIC-8 FL 1500Ă/ĂaTpe & Reel
(Pb-Free)
NTMFS4709NT3G SOIC-8 FL 5000Ă/ĂaTpe & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2007
1
July, 2007 - Rev. 3
Publication Order Number:
NTMFS4709N/D