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NTMFS4708N Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET 30 V, 19 A, Single N-Channel, SOIC-8 FL
NTMFS4708N
Power MOSFET
30 V, 19 A, Single N-Channel, SOIC-8 FL
Features
•ăFast Switching Times
•ăLow Gate Charge
•ăLow RDS(on)
•ăLow Inductance SOIC-8 Package
•ăThese are Pb-Free Devices
Applications
•ăNotebooks, Graphics Cards
•ăDC-DC Converters
•ăSynchronous Rectification
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain-to-Source Voltage
VDSS
30
V
Gate-to-Source Voltage
VGS
±20 V
Continuous Drain Current Steady TA = 25°C
ID
(Note 1)
State TA = 85°C
11.5 A
8.0
t ≤ 10 s TA = 25°C
19
Power Dissipation
(Note 1)
Steady TA = 25°C PD
State
2.2 W
t ≤ 10 s
Continuous Drain Current
TA = 25°C
ID
(Note 2)
Steady TA = 85°C
Power Dissipation
State TA = 25°C
PD
(Note 2)
6.25
7.8 A
5.6
1.0 W
Pulsed Drain Current
tp ≤ 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain-to-Source Avalanche
Energy. VDD = 25 V, VGS = 10 V, IPK = 7.0 A,
L = 10 mH, RG = 25 W
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
IDM
TJ,
TSTG
IS
EAS
58
A
-55 to °C
150
6.25 A
245 mJ
TL
260 °C
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
Junction-to-Ambient – Steady State (Note 1)
RqJA
56.5 °C/W
Junction-to-Ambient – t ≤ 10 s (Note 1)
RqJA
20
Junction-to-Ambient – Steady State (Note 2)
RqJA
124
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface-mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface-mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.412 in sq).
http://onsemi.com
V(BR)DSS
30 V
RDS(on) Typ
7.3 mW @ 10 V
10.1 mW @ 4.5 V
ID Max
19 A
N-Channel
D
G
S
MARKING DIAGRAM &
PIN ASSIGNMENT
D
1
SOIC-8 FLAT LEAD
CASE 488AA
STYLE 1
S
D
S 4708N
S AYWWĂG
G
G
D
D
4708N = Specific Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NTMFS4708NT1G SOIC-8 FL 1500Ă/ĂaTpe & Reel
(Pb-Free)
NTMFS4708NT3G SOIC-8 FL 5000Ă/ĂaTpe & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2007
1
July, 2007 - Rev. 2
Publication Order Number:
NTMFS4708N/D