NTMFS4701N Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET 30 V, 20 A, Single N-Channel, SOIC-8 Flat Lead Package

NTMFS4701N
Power MOSFET
30 V, 20 A, Single N-Channel,
SOIC-8 Flat Lead Package
Features
•ăThermally and Electrically Enhanced Packaging Compatible with
Standard SOIC-8
•ăNew Package Provides Capability of Inspection and Probe After
Board Mounting
•ăUltra Low R_DS(on) (at 4.5 V_GS), Low Gate Resistance and Low Q_G
•ăOptimized for High Side Control Applications
•ăHigh Speed Switching Capability
•ăThese are Pb-Free Devices
Applications
•ăNotebook Computer VCORE Applications
•ăNetwork Applications
•ăDC-DC Converters
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain-to-Source Voltage
V_DSS
30
V
Gate-to-Source Voltage
V_GS
$20
V
Continuous Drain Current
(Note 1 )
Steady ^{TA = 25°C}
State _{TA = 70°C}
I_D
12.3 A
9.8
t v10 s T_A = 25°C
I_D
20
Power Dissipation
(Note 1)
Steady
State
T_A = 25°C
P_D
2.3 W
t v10 s T_A = 25°C P_D
Continuous Drain Current
T_A = 25°C
I_D
(Note 2)
Steady TA = 70°C
Power Dissipation
(Note 2)
State
T_A = 25°C
P_D
6.0
7.7
A
6.2
0.9 W
Pulsed Drain Current
t_p = 10 ms
Operating and Storage Temperature
I_DM
60
A
T_J, T_stg -55 to °C
150
Source Current (Body Diode)
I_S
Single Pulse Drain-to-Source Avalanche Energy E_AS
(V_DD = 25 V, V_GS = 10 V, I_PK = 7.5 A,
L = 10 mH, R_G = 25 W)
Lead Temperature for Soldering Purposes
T_L
(1/8 in from case for 10 s)
6.0
A
280 mJ
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface-mounted on FR4 board using 1 in sq. pad size
(Cu area 1.127 in sq. [1 oz} including traces).
2. Surface-mounted on FR4 board using minimum recommended pad size
(Cu area 0.412 in sq.).
http://onsemi.com
V_(BR)DSS
30 V
R_DS(on) Typ
6.0 mW @ 10 V
8.0 mW @ 4.5 V
I_D Max
20 A
N-Channel
D
G
S
MARKING DIAGRAM &
PIN ASSIGNMENT
1
SOIC-8 FLAT LEAD
CASE 488AA
STYLE 1
D
S
D
S 4701N
S AYWWĂG
G
G
D
D
4701N
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
NTMFS4701NT1G SOIC-8 FL 1500Ă/ĂaTpe & Reel
(Pb-Free)
NTMFS4701NT3G SOIC-8 FL 5000Ă/ĂaTpe & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2007
1
July, 2007 - Rev. 3
Publication Order Number:
NTMFS4701N/D