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NTMFS4121N Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 30 V, 29 A, Single N-Channel, SO-8 Flat Lead
NTMFS4121N
Power MOSFET
30 V, 29 A, Single N-Channel,
SO-8 Flat Lead
Features
•ăLow RDS(on)
•ăOptimized Gate Charge
•ăLow Inductance SO-8 Package
•ăThese are Pb-Free Devices
Applications
•ăNotebooks, Graphics Cards
•ăDC-DC Converters
•ăSynchronous Rectification
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain-to-Source Voltage
VDSS
30
V
Gate-to-Source Voltage
VGS
20
V
Continuous Drain Current Steady TA = 25°C
ID
(Note 1 )
State TA = 85°C
t v10 s TA = 25°C
Power Dissipation (Note 1) Steady
PD
State TA = 25°C
t v10 s
17
A
12
29
2.2 W
6.6
Continuous Drain Current
TA = 25°C
ID
(Note 2)
Steady
State
TA = 85°C
Power Dissipation (Note 2)
TA = 25°C PD
11
A
8.0
0.9 W
Pulsed Drain Current
tp = 10 ms
IDM
88
A
Operating Junction and Storage Temperature
TJ, Tstg -55 to °C
150
Source Current (Body Diode)
IS
6.5
A
Single Pulse Drain-to-Source Avalanche Energy
EAS
430 mJ
(VDD = 30 V, VGS = 10 V, IPK = 29 A,
L = 1 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL
260 °C
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
Junction-to-Case - Steady State
RqJC
2.2 °C/W
Junction-to-Ambient - Steady State (Note 1)
RqJA 56.2 °C/W
Junction-to-Ambient - t v10 s (Note 1)
RqJA
19
Junction-to-Ambient - Steady State (Note 2)
RqJA 141.1
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface mounted on FR4 board using the minimum recommended pad size
(Cu area = 1.0 in sq).
http://onsemi.com
V(BR)DSS
30 V
RDS(on) Typ
4.0 mW @ 10 V
5.5 mW @ 4.5 V
ID Max
(Note 1)
29 A
D
G
S
1
SO-8 FLAT LEAD
CASE 488AA
STYLE 1
MARKING
DIAGRAM
D
S
D
S 4121N
S AYWWG
G
G
D
D
4121N = Specific Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NTMFS4121NT1G SO-8 FL 1500 Tape & Reel
(Pb-Free)
NTMFS4121NT3G SO-8 FL 5000 Tape & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2007
1
July, 2007 - Rev. 3
Publication Order Number:
NTMFS4121N/D