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NTMD6P02R2G Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 6 A, 20 V, P−Channel SOIC−8, Dual | |||
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NTMD6P02, NVMD6P02
Power MOSFET
6 A, 20 V, PâChannel SOICâ8, Dual
Features
⢠Ultra Low RDS(on)
⢠Higher Efficiency Extending Battery Life
⢠Logic Level Gate Drive
⢠Miniature Dual SOICâ8 Surface Mount Package
⢠Diode Exhibits High Speed, Soft Recovery
⢠Avalanche Energy Specified
⢠These Devices are PbâFree and are RoHS Compliant
⢠NVMD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECâQ101
Qualified and PPAP Capable
Applications
⢠Power Management in Portable and BatteryâPowered Products,
i.e.: Cellular and Cordless Telephones, and PCMCIA Cards
MAXIMUM RATINGS
http://onsemi.com
6 AMPERES, 20 VOLTS
PâChannel
D
G
Rating
Symbol Value Unit
S
DrainâtoâSource Voltage
GateâtoâSource Voltage â Continuous
Thermal Resistance â
JunctionâtoâAmbient (Note 1)
Total Power Dissipation @ TA = 25°C
Continuous Drain Current @ TA = 25°C
Continuous Drain Current @ TA = 70°C
Maximum Operating Power Dissipation
Maximum Operating Drain Current
Pulsed Drain Current (Note 4)
Thermal Resistance â
JunctionâtoâAmbient (Note 2)
Total Power Dissipation @ TA = 25°C
Continuous Drain Current @ TA = 25°C
Continuous Drain Current @ TA = 70°C
Maximum Operating Power Dissipation
Maximum Operating Drain Current
Pulsed Drain Current (Note 4)
Thermal Resistance â
JunctionâtoâAmbient (Note 3)
Total Power Dissipation @ TA = 25°C
Continuous Drain Current @ TA = 25°C
Continuous Drain Current @ TA = 70°C
Maximum Operating Power Dissipation
Maximum Operating Drain Current
Pulsed Drain Current (Note 4)
Operating and Storage Temperature Range
VDSS
â20
V
VGS
"12
V
RqJA
PD
ID
ID
PD
ID
IDM
62.5
2.0
â7.8
â5.7
0.5
â3.89
â40
°C/W
W
A
A
W
A
A
RqJA
PD
ID
ID
PD
ID
IDM
98
1.28
â6.2
â4.6
0.3
â3.01
â35
°C/W
W
A
A
W
A
A
RqJA
PD
ID
ID
PD
ID
IDM
TJ, Tstg
166
0.75
â4.8
â3.5
0.2
â2.48
â30
â55 to
+150
°C/W
W
A
A
W
A
A
°C
8
1
SOICâ8
CASE 751
STYLE 11
MARKING DIAGRAM &
PIN ASSIGNMENT
D1 D1 D2 D2
8
E6P02x
AYWW G
G
1
S1 G1 S2 G2
E6P02 = Specific Device Code
x
= Blank or S
A
= Assembly Location
Y
= Year
WW = Work Week
G
= PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
NTMD6P02R2G
Package
Shippingâ
SOICâ8 2500 / Tape & Reel
(PbâFree)
Single Pulse DrainâtoâSource Avalanche
EAS
500 mJ
Energy â Starting TJ = 25°C (VDD = â20 Vdc,
VGS = â5.0 Vdc, Peak IL = â5.0 Apk,
L = 40 mH, RG = 25 W)
Maximum Lead Temperature for Soldering
Purposes for 10 seconds
TL
260 °C
NTMD6P02R2SG SOICâ8 2500 / Tape & Reel
(PbâFree)
NVMD6P02R2G SOICâ8 2500 / Tape & Reel
(PbâFree)
â For information on tape and reel specifications,
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D
Recommended Operating Conditions may affect device reliability.
1. Mounted onto a 2â³ square FRâ4 Board (1 in sq, 2 oz. Cu 0.06â³ thick single sided), t = 10 seconds.
2. Mounted onto a 2â³ square FRâ4 Board (1 in sq, 2 oz. Cu 0.06â³ thick single sided), t = steady state.
3. Minimum FRâ4 or Gâ10 PCB, t = steady state.
4. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2%.
© Semiconductor Components Industries, LLC, 2012
1
December, 2012 â Rev. 4
Publication Order Number:
NTMD6P02R2/D
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