|
NTMD6N04R2 Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET 40 V, 5.8 A, Dual N-Channel SOIC-8 | |||
|
NTMD6N04R2
Power MOSFET
40 V, 5.8 A, Dual N-Channel SOIC-8
Features
â¢ÄDesigned for use in low voltage, high speed switching applications
â¢ÄUltra Low On-Resistance Provides
Higher Efficiency and Extends Battery Life
Ä
- RDS(on) = 0.027 W, VGS = 10 V (Typ)
Ä
- RDS(on) = 0.034 W, VGS = 4.5 V (Typ)
â¢ÄMiniature SOIC-8 Surface Mount Package Saves Board Space
â¢ÄDiode is Characterized for Use in Bridge Circuits
â¢ÄDiode Exhibits High Speed, with Soft Recovery
â¢ÄPb-Free Package is Available
Applications
â¢ÄDC-DC Converters
â¢ÄComputers
â¢ÄPrinters
â¢ÄCellular and Cordless Phones
â¢ÄDisk Drives and Tape Drives
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain-to-Source Voltage
Gate-to-Source Voltage - Continuous
Drain Current (Note 1)
- Continuous @ TA = 25°C
- Single Pulse (tp ⤠10 ms)
Drain Current (Note 2)
- Continuous @ TA = 25°C
Total Power Dissipation
@ TA = 25°C (Note 1)
@ TA = 25°C (Note 2)
Operating and Storage Temperature
Range
VDSS
VGS
ID
IDM
ID
40
V
"20
V
5.8
Adc
29
Apk
4.6
Adc
PD
W
2.0
1.29
TJ, Tstg -55 to +150 °C
Single Pulse Drain-to-Source Avalanche
Energy - Starting TJ = 25°C
(VDD = 40 Vdc, VGS = 5.0 Vdc,
Vdc, Peak IL = 7.0 Apk,
L = 10 mH, RG = 25 W)
Thermal Resistance
- Junction-to-Ambient (Note 1)
- Junction-to-Ambient (Note 2)
EAS
RqJA
245
mJ
°C/W
62.5
97
Maximum Lead Temperature for
Soldering Purposes for 10 Sec
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 1Ⳡpad size, t ⤠10 s
2. When surface mounted to an FR4 board using 1â³ pad size, t = steady state
http://onsemi.com
VDSS
40 V
RDS(ON) Typ
27 mW @ VGS = 10 V
ID Max
5.8 A
N-Channel
D
D
G
G
S
S
8
1
SOIC-8
CASE 751
STYLE 11
MARKING DIAGRAM &
PIN ASSIGNMENT
D1 D1 D2 D2
8
E6N04
AYWWÄG
G
1
S1 G1 S2 G2
E6N04 = Specific Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shippingâ
NTMD6N04R2G SOIC-8 2500/Tape & Reel
(Pb-Free)
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
婀 Semiconductor Components Industries, LLC, 2007
1
December, 2007 - Rev. 0
Publication Order Number:
NTMD6N04R2/D
|
▷ |