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NTMD5838NL Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 30 V, 11.6 A, N−Channel, SO−8 Optimized Gate Charge | |||
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NTMD5838NL
Power MOSFET
40 V, 8.9 A, 25 mW, Dual NâChannel SOâ8
Features
⢠Low RDS(on)
⢠Low Capacitance
⢠Optimized Gate Charge
⢠These Devices are PbâFree, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
DrainâtoâSource Voltage
GateâtoâSource Voltage
Continuous Drain
Current RqJA
(Note 1)
Power Dissipation
RqJA (Note 1)
Continuous Drain
Current RqJA
(Note 1)
Power Dissipation
RqJA (Note 1)
Pulsed Drain
Current
TA = 25°C
Steady
State
TA = 70°C
TA = 25°C
TA = 70°C
TA = 25°C
t â¤10 s
TA = 70°C
TA = 25°C
TA = 70°C
tp = 10 ms
VDSS
VGS
ID
PD
ID
PD
IDM
40
V
±20
V
7.4
A
5.9
2.1
W
1.3
8.9
A
7.1
3.0
W
1.9
35
A
Operating Junction and Storage
Temperature
TJ, TSTG â55 to °C
+150
Source Current (Body Diode)
Single Pulse DrainâtoâSource Avalanche
Energy (L = 0.1 mH)
IS
EAS
IAS
7.0
A
20
mJ
21
A
Lead Temperature for Soldering Purposes
(1/8â³ from case for 10 s)
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
JunctionâtoâAmbient Steady State
(Notes 1 & 3)
RqJA
58
JunctionâtoâAmbient â t â¤10 s (Note 1)
RqJA
40
°C/W
JunctionâtoâAmbient Steady State (Note 2)
RqJA
106
1. Surfaceâmounted on FR4 board using 1 sqâin pad
(Cu area = 1.127 in sq [2 oz] including traces).
2. Surfaceâmounted on FR4 board using 0.155 in sq (100mm2) pad size.
3. Both channels receive equivalent power dissipation
1 W applied on each channel: TJ = 2 W * 58°C/W + 25°C = 141°C
http://onsemi.com
V(BR)DSS
40 V
RDS(ON) MAX
25 mW @ 10 V
30.8 mW @ 4.5 V
ID MAX
8.9 A
NâCHANNEL MOSFET
D
D
G
G
S
S
MARKING DIAGRAM/
PIN ASSIGNMENT
D1 D1 D2 D2
8
SOâ8
CASE 751
STYLE 11
D5838N
AYWW
G
1
S1 G1 S2 G2
(Top View)
A
= Assembly Location
Y
= Year
WW = Work Week
G
= PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shippingâ
NTMD5838NLR2G SOâ8 2500/Tape & Reel
(PbâFree)
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
April, 2011 â Rev. 0
Publication Order Number:
NTMD5838NL/D
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