NTMD3N08LR2 Datasheet, PDF (1/12 Pages) ON Semiconductor – Power MOSFET 2.3 Amps, 80 Volts

NTMD3N08LR2
Advance Information
Power MOSFET
2.3 Amps, 80 Volts
N–Channel Enhancement–Mode
SO–8 Dual Package
Features
• Ultra Low On–Resistance Provides Higher Efficiency
♦ R_DS(on) = 0.215 W, V_GS = 10 V
♦ R_DS(on) = 0.245 W, V_GS = 5.0 V
• Low Reverse Recovery Losses
• Internal R_G = 50 W
• Designed for Power Management Solutions in 42 V Automotive
System Applications
• I_DSS and R_DS(on) Specified at Elevated Temperature
• Avalanche Energy Specified
• Miniature SO–8 Surface Mount Package – Saves Board Space
• Mounting Information for SO–8 Package Provided
Applications
• Integrated Starter Alternator
• Electronic Power Steering
• Electronic Fuel Injection
• Catalytic Converter Heaters
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain–to–Source Voltage
V_DSS
80
V
Drain–to–Source Voltage (R_GS = 1.0 mW)
V_DGR
80
Gate–to–Source Voltage – Continuous
Gate–to–Source Voltage –
Non–Repetitive (t_p ≤ 10 ms)
V_GS
±15
V
V_GSM
±20
Continuous Drain Current @ T_A = 25°C
Pulsed Drain Current (Note 1)
I_D
2.3
A
I_DM
25
Total Power Dissipation @ T_A = 25°C (Note 2)
P_D
3.1
W
Operating and Storage Temperature Range T_J, T_stg –55 to °C
+175
Single Pulse Drain–to–Source Avalanche
Energy – Starting T_J = 25°C (V_DD = 50 Vdc,
V_GS = 5.0 Vdc, Peak I_L = 7.0 Apk,
L = 1.0 mH, R_G = 25 W)
Thermal Resistance –
Junction–to–Ambient (Note 2)
E_AS
R_qJA
25
mJ
48
°C/W
Maximum Lead Temperature for Soldering
T_L
260
°C
Purposes for 10 Seconds
1. Pulse Test: Pulse Width = 10 ms, Duty Cycle = 2%
2. Mounted onto a 2″ square FR–4 board (1″ sq. oz. Cu 0.06″ thick single sided),
t ≤ 5 seconds
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
http://onsemi.com
2.3 AMPERES
80 VOLTS
215 mΩ @ V_GS = 5 V (Typ)
DUAL SO–8
CASE 751
STYLE 11
MARKING DIAGRAM
& PIN ASSIGNMENT
Source 1 ¹
8
Drain 1
Gate 1 ²
3N08
7
Drain 1
3
Source 2
AYWW
6
Drain 2
4
Gate 2
5
Drain 2
(Top View)
3N08
A
Y
WW
= Specific Device Code
= Assembly Location
= Year
= Work Week
ORDERING INFORMATION
Device
Package
Shipping
NTMD3N08LR2
SO–8 2500/Tape & Reel
© Semiconductor Components Industries, LLC, 2002
1
August, 2002 – Rev. 2
Publication Order Number:
NTMD3N08LR2/D