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NTMD2C02R2G Datasheet, PDF (1/12 Pages) ON Semiconductor – Power MOSFET 2 Amps, 20 Volts | |||
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NTMD2C02R2
Preferred Device
Power MOSFET
2 Amps, 20 Volts
Complementary SOICâ8, Dual
These miniature surface mount MOSFETs feature ultra low RDS(on)
and true logic level performance. They are capable of withstanding
high energy in the avalanche and commutation modes and the
drainâtoâsource diode has a very low reverse recovery time.
MiniMOSt devices are designed for use in low voltage, high speed
switching applications where power efficiency is important. Typical
applications are dcâdc converters, and power management in portable
and battery powered products such as computers, printers, cellular and
cordless phones. They can also be used for low voltage motor controls
in mass storage products such as disk drives and tape drives.
Features
⢠Ultra Low RDS(on) Provides Higher Efficiency and Extends
Battery Life
⢠Logic Level Gate Drive â Can Be Driven by Logic ICs
⢠Miniature SOICâ8 Surface Mount Package â Saves Board Space
⢠Diode Is Characterized for Use In Bridge Circuits
⢠Diode Exhibits High Speed, With Soft Recovery
⢠IDSS Specified at Elevated Temperature
⢠Mounting Information for SOICâ8 Package Provided
⢠PbâFree Packages are Available
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) (Note 1)
Rating
Symbol Value Unit
DrainâtoâSource Voltage
NâChannel
PâChannel
GateâtoâSource Voltage
Drain Current â Continuous
â Pulsed
NâChannel
PâChannel
NâChannel
PâChannel
Operating and Storage Temperature Range
Total Power Dissipation @ TA= 25°C
(Note 2)
Thermal Resistance â Junction to Ambient
(Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8â³ from case for 10 seconds.
VDSS
VGS
ID
IDM
TJ and
Tstg
PD
RqJA
TL
Vdc
20
20
±12 Vdc
5.2
A
3.4
48
17
â55 to °C
150
2.0
W
62.5 °C/W
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Negative signs for PâChannel device omitted for clarity.
2. Mounted on 2â³ square FR4 board (1â³ sq. 2 oz. Cu 0.06â³ thick single sided) with
one die operating, 10 sec. max.
http://onsemi.com
2 AMPERES
20 VOLTS
RDS(on) = 43 mW (NâChannel)
RDS(on) = 120 mW (PâChannel)
NâChannel
D
PâChannel
D
G
G
S
8
1
SOICâ8
CASE 751
STYLE 14
S
MARKING DIAGRAM &
PIN ASSIGNMENT
ND ND PD PD
8
D2C02x
AYWW G
G
1
NS NG PS PG
D2C02 = Specific Device Code
x
= Blank or S
A
= Assembly Location
Y
= Year
WW = Work Week
G
= PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
NTMD2C02R2
Package
Shippingâ
SOICâ8 2500/Tape & Reel
NTMD2C02R2G
SOICâ8 2500/Tape & Reel
(PbâFree)
NTMD2C02R2SG SOICâ8 2500/Tape & Reel
(PbâFree)
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2006
1
March, 2006 â Rev. 1
Publication Order Number:
NTMD2C02R2/D
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