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NTLUS3A40PZ Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 20 V, 9.4Cool Single P Channel ESD 2.0x2.0x0.55 mm UDFNPackage
NTLUS3A40PZ
Power MOSFET
−20 V, −9.4 A, mCoolt Single P−Channel,
ESD, 2.0x2.0x0.55 mm UDFN Package
Features
• UDFN Package with Exposed Drain Pads for Excellent Thermal
Conduction
• Low Profile UDFN 2.0x2.0x0.55 mm for Board Space Saving
• Lowest RDS(on) in 2.0x2.0 Package
• ESD Protected
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• High Side Load Switch
• PA Switch and Battery Switch
• Optimized for Power Management Applications for Portable
Products, such as Cell Phones, PMP, DSC, GPS, and others
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value
Units
Drain-to-Source Voltage
VDSS
−20
V
Gate-to-Source Voltage
VGS
±8.0
V
Continuous Drain Steady TA = 25°C
ID
Current (Note 1)
State
TA = 85°C
−6.4
A
−4.6
t ≤ 5 s TA = 25°C
−9.4
Power Dissipa-
Steady TA = 25°C
PD
tion (Note 1)
State
1.7
W
t ≤ 5 s TA = 25°C
3.8
Continuous Drain Steady TA = 25°C
ID
Current (Note 2)
State
TA = 85°C
−4.0
A
−2.9
Power Dissipation (Note 2)
TA = 25°C
PD
0.7
W
Pulsed Drain Current
tp = 10 ms
IDM
−30
A
Operating Junction and Storage
Temperature
TJ,
-55 to °C
TSTG
150
Source Current (Body Diode) (Note 2)
IS
−1.0
A
Lead Temperature for Soldering Purposes
TL
260
°C
(1/8″ from case for 10 s)
ESD Rating (HBM) per JESD22−A114F
ESD >2000 V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface-mounted on FR4 board using the minimum recommended pad size
of 30 mm2, 2 oz. Cu.
http://onsemi.com
V(BR)DSS
−20 V
MOSFET
RDS(on) MAX
29 mW @ −4.5 V
39 mW @ −2.5 V
60 mW @ −1.8 V
120 mW @ −1.5 V
ID MAX
−9.4 A
S
G
D
P−Channel MOSFET
MARKING
DIAGRAM
6
UDFN6
1
CASE 517BG
AA MG
mCOOLt
G
1
AA = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
1
July, 2011 − Rev. 3
Publication Order Number:
NTLUS3A40PZ/D