NTLUS3A18PZ_16 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET

NTLUS3A18PZ
Power MOSFET
−20 V, −8.2 A, Single P−Channel,
2.0x2.0x0.55 mm UDFN Package
Features
• UDFN Package with Exposed Drain Pads for Excellent Thermal
Conduction
• Low Profile UDFN 2.0x2.0x0.55 mm for Board Space Saving
• Ultra Low R_DS(on)
• ESD Diode−Protected Gate
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Optimized for Power Management Applications for Portable
Products, such as Cell Phones, Media Tablets, PMP, DSC, GPS, and
Others
• Battery Switch
• High Side Load Switch
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain-to-Source Voltage
V_DSS
−20
V
Gate-to-Source Voltage
V_GS
±8.0
V
Continuous Drain Steady T_A = 25°C
I_D
Current (Note 1)
State
Continuous Drain
T_A = 85°C
−8.2
A
−5.9
Current (Note 1)
t ≤ 5 s T_A = 25°C
−12.2
Power Dissipa-
Steady T_A = 25°C
P_D
tion (Note 1)
State
1.7
W
t ≤ 5 s T_A = 25°C
3.8
Continuous Drain Steady T_A = 25°C
I_D
Current (Note 2)
State
T_A = 85°C
−5.1
A
−3.7
Power Dissipation (Note 2)
T_A = 25°C
P_D
0.7
W
Pulsed Drain Current
tp = 10 ms
I_DM
−25
A
Operating Junction and Storage
Temperature
T_J,
-55 to °C
T_STG
150
ESD (HBM, JESD22−A114)
V_ESD
2000
V
Source Current (Body Diode) (Note 2)
I_S
−1.7
A
Lead Temperature for Soldering Purposes
T_L
260
°C
(1/8″ from case for 10 s)
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface-mounted on FR4 board using the minimum recommended pad size
of 30 mm², 2 oz. Cu.
© Semiconductor Components Industries, LLC, 2016
1
April, 2016 − Rev. 4
www.onsemi.com
V_(BR)DSS
−20 V
MOSFET
R_DS(on) MAX
18 mW @ −4.5 V
25 mW @ −2.5 V
50 mW @ −1.8 V
90 mW @ −1.5 V
I_D MAX
−8.2 A
D
G
S
P−Channel MOSFET
S
Pin 1
MARKING DIAGRAM
D
1
UDFN6
CASE 517BG
AC MG
G
AC = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
Publication Order Number:
NTLUS3A18PZ/D