NTLUD3C20CZ_16 Datasheet, PDF (1/4 Pages) ON Semiconductor – Small Signal MOSFET

NTLUD3C20CZ
Product Preview
Small Signal MOSFET
12 V, Complementary, 2.0 x 2.0 mm UDFN
Package
Features
• Advanced Trench Complementary MOSFET
• Low RDS(on)
• Low Profile UDFN 2.0x2.0x0.55mm for Board Space Saving
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Power Load Switch
• Load Switch with Level Shift
• Optimized for Power Management in Ultra Portable Devices
MAXIMUM RATINGS (T_J = 25°C unless otherwise specified)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
NMOS
12
PMOS
V_DSS
12
V
Gate−to−Source Voltage
NMOS
PMOS
±8.0
V_GS
V
±8.0
N−Channel
Continuous Drain
Current (Note 1)
P−Channel
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Pulsed Drain Current
Steady ^{TA = 25°C}
State
T_A = 85°C
I_D
t v 5 s T_A = 25°C
Steady ^{TA = 25°C}
State
T_A = 85°C
I_D
t v 5 s T_A = 25°C
Steady
State
T_A = 25°C
P_D
t v 5 s T_A = 25°C
NMOS
PMOS
t_p = 10 ms
I_DM
6.4
4.6
A
8.1
−4.6
−3.3 _A
−5.9
1.40 _W
2.29 W
21
A
14
Source Current (Body Diode)
I_S
1.6
A
−1.6
Operating Junction and Storage Temperature
Lead Temperature for Soldering Purposes (1/8”
from case for 10 s)
T_J,
T_STG
T_L
−55 to
150
°C
260 _°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in
sq), 1 oz. Cu.
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
www.onsemi.com
V_(BR)DSS
N−Channel
12 V
P−Channel
−12 V
R_DS(on) Max
23 mW @ 4.5 V
26 mW @ 3.3 V
31 mW @ 2.5 V
59 mW @ 1.8 V
44 mW @ −4.5 V
55 mW @ −3.3 V
75 mW @ −2.5 V
175 mW @ −1.8 V
I_D Max
6.4 A
−4.6 A
SYMBOLS AND PIN CONNECTIONS
D1
S2
G1
G2
S1
NMOS
D2
PMOS
MARKING DIAGRAM
UDFN6
CASE 527AD
1
AAMG
G
AA = Specific Device Code
M = Date Code
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
NTLUD3C20CZTAG _{UDFN6 3000 / Tape &}
NTLUD3C20CZTBG ^{(Pb−Free)}
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
1
July, 2016 − Rev. P2
Publication Order Number:
NTLUD3C20CZ/D