NTLUD3A50PZ_14 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET

NTLUD3A50PZ
Power MOSFET
−20 V, −5.6 A, mCoolt Dual P−Channel,
2.0x2.0x0.55 mm UDFN Package
Features
• UDFN Package with Exposed Drain Pads for Excellent Thermal
Conduction
• Low R_DS(on)
• Low Profile UDFN 2.0x2.0x0.55 mm for Board Space Saving
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• High Side Load Switch
• Reverse Current Protection
• Battery Switch
• Optimized for Power Management Applications for Portable
Products, such as Cell Phones, PMP, DSC, GPS, and others
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value
Units
Drain-to-Source Voltage
V_DSS
−20
V
Gate-to-Source Voltage
V_GS
±8.0
V
Continuous Drain Steady T_A = 25°C
I_D
Current (Note 1)
State
T_A = 85°C
−4.4
A
−3.2
t ≤ 5 s T_A = 25°C
−5.6
Power Dissipa-
Steady T_A = 25°C
P_D
tion (Note 1)
State
1.4
W
t ≤ 5 s T_A = 25°C
2.2
Continuous Drain Steady T_A = 25°C
I_D
Current (Note 2)
State
T_A = 85°C
−2.8
A
−2.0
Power Dissipation (Note 2)
T_A = 25°C
P_D
0.5
W
Pulsed Drain Current
tp = 10 ms
I_DM
−13
A
Operating Junction and Storage
Temperature
T_J,
-55 to °C
T_STG
150
ESD (HBM, JESD22−A114)
ESD (MM, JESD22−A114)
V_ESD
1400
V
200
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
I_S
−1.0
A
T_L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces) based on both FETs on.
2. Surface-mounted on FR4 board using the minimum recommended pad size
of 30 mm², 1 oz. Cu based on both FETs on.
http://onsemi.com
V_(BR)DSS
−20 V
MOSFET
R_DS(on) MAX
50 mW @ −4.5 V
70 mW @ −2.5 V
115 mW @ −1.8 V
175 mW @ −1.5 V
I_D MAX
−5.6 A
D1
D2
G1
G2
S1
S2
P−Channel MOSFET
MARKING
DIAGRAM
6
UDFN6
1
CASE 517BF
AA MG
mCOOLt
G
1
AA = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
February, 2014 − Rev. 2
Publication Order Number:
NTLUD3A50PZ/D