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NTLUD3191PZ Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET −20 V, −1.8 A, Cool Dual P−Channel, ESD, 1.6x1.6x0.55 mm UDFN Package
NTLUD3191PZ
Power MOSFET
−20 V, −1.8 A, mCoolt Dual P−Channel,
ESD, 1.6x1.6x0.55 mm UDFN Package
Features
• UDFN Package with Exposed Drain Pads for Excellent Thermal
Conduction
• Low Profile UDFN 1.6 x 1.6 x 0.55 mm for Board Space Saving
• ESD
• This is a Halide Free Device
• This is a Pb−Free Device
Applications
• High Side Load Switch
• PA Switch
• Battery Switch
• Optimized for Power Management Applications for Portable
Products, such as Cell Phones, PMP, DSC, GPS, and others
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Units
Drain-to-Source Voltage
VDSS
−20
V
Gate-to-Source Voltage
VGS
±8.0
V
Continuous Drain Steady TA = 25°C
ID
Current (Note 1)
State
TA = 85°C
−1.4
A
−1.0
t ≤ 5 s TA = 25°C
−1.8
Power Dissipation Steady TA = 25°C
PD
(Note 1)
State
0.8
W
t ≤ 5 s TA = 25°C
1.3
Continuous Drain Steady TA = 25°C
ID
Current (Note 2)
State
TA = 85°C
−1.1
A
−0.8
Power Dissipation (Note 2)
TA = 25°C
PD
0.5
W
Pulsed Drain Current
tp = 10 ms
IDM
−8.0
A
Operating Junction and Storage
Temperature
TJ,
-55 to °C
TSTG
150
Source Current (Body Diode) (Note 2)
IS
−1.0
A
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL
260
°C
Gate-to-Source ESD Rating
(HBM) per JESD22−A114F
ESD
1000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface-mounted on FR4 board using the minimum recommended pad size
of 30 mm2, 2 oz. Cu.
http://onsemi.com
V(BR)DSS
−20 V
RDS(on) MAX
250 mW @ −4.5 V
380 mW @ −2.5 V
500 mW @ −1.8 V
700 mW @ −1.5 V
ID MAX
−1.5 A
−1.0 A
−0.5 A
−0.2 A
D1
D2
G1
G2
S1
S2
P−Channel MOSFET
6
UDFN6
CASE 517AT
1
mCOOLt
MARKING
DIAGRAM
1
AC MG
G
AC = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2009
1
April, 2009 − Rev. 1
Publication Order Number:
NTLUD3191PZ/D