NTLJS4114N_12 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET

NTLJS4114N
Power MOSFET
30 V, 7.8 A, mCoolt Single N−Channel,
2x2 mm WDFN Package
Features
• WDFN Package Provides Exposed Drain Pad for Excellent Thermal
Conduction
• 2x2 mm Footprint Same as SC−88
• Lowest R_DS(on) in 2x2 mm Package
• 1.8 V R_DS(on) Rating for Operation at Low Voltage Logic Level Gate
Drive
• Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
• This is a Pb−Free Device
Applications
• DC−DC Conversion
• Boost Circuits for LED Backlights
• Optimized for Battery and Load Management Applications in
Portable Equipment such as, Cell Phones, PDA’s, Media Players, etc.
• Low Side Load Switch for Noisy Environment
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
30
V
Gate−to−Source Voltage
V_GS
±12
V
Continuous Drain
Current (Note 1)
Steady ^{TA = 25°C}
I_D
State _{TA = 85°C}
6.0
A
4.4
t ≤ 5 s T_A = 25°C
7.8
Power Dissipation
(Note 1)
Steady
P_D
State _{TA = 25°C}
t≤5s
1.92
W
3.3
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
T_A = 25°C
I_D
Steady T_A = 85°C
State
T_A = 25°C
P_D
3.6
A
2.6
0.70
W
Pulsed Drain Current
t_p = 10 ms
I_DM
28
A
Operating Junction and Storage Temperature T_J, T_STG −55 to °C
150
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
I_S
3.0
A
T_L
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size
of 30 mm2, 2 oz Cu.
http://onsemi.com
V_(BR)DSS
30 V
R_DS(on) MAX
35 mW @ 4.5 V
45 mW @ 2.5 V
55 mW @ 1.8 V
I_D MAX (Note 1)
7.8 A
S
G
D
N−CHANNEL MOSFET
S
D
MARKING
DIAGRAM
Pin 1
WDFN6
CASE 506AP
STYLE 1
1
2
JA M G
6
5
3 ^G4
JA
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
D1
D2
G3
D
S
6D
5D
4S
(Top View)
ORDERING INFORMATION
Device
Package
Shipping^†
NTLJS4114NT1G
NTLJS4114NTAG
WDFN6
(Pb−Free)
WDFN6
(Pb−Free)
3000/Tape & Reel
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
1
November, 2012 − Rev. 3
Publication Order Number:
NTLJS4114N/D