NTLJS3A18PZ Datasheet, PDF (1/6 Pages) ON Semiconductor – Single P−Channel Power MOSFET

NTLJS3A18PZ
Power MOSFET
−20 V, −8.2 A, mCoolt Single P−Channel,
2.0x2.0x0.8 mm WDFN Package
Features
• WDFN Package with Exposed Drain Pads for Excellent Thermal
Conduction
• Low Profile WDFN (2.0x2.0x0.8 mm) for Board Space Saving
• Ultra Low R_DS(on)
• ESD Diode−Protected Gate
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Optimized for Power Management Applications for Portable
Products, such as Smart Phones, Media Tablets, PMP, DSC, GPS, and
Others
• Battery Switch
• High Side Load Switch
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
−20
V
Gate−to−Source Voltage
V_GS
±8.0
V
Continuous Drain
Current (Note 1)
Steady ^TA ^{= 25°C}
I_D
State _{TA = 85°C}
−8.2
A
−5.9
t ≤ 5 s T_A = 25°C
−11.2
Power Dissipation
(Note 1)
Steady
P_D
State _{TA = 25°C}
t ≤5 s
1.8
W
3.4
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
T_A = 25°C
I_D
Steady T_A = 85°C
State
T_A = 25°C
P_D
−5.0
A
−3.6
0.7
W
Pulsed Drain Current
t_p = 10 ms
I_DM
−40
A
Operating Junction and Storage Temperature T_J, T_STG −55 to °C
150
ESD (HBM, JESD22−A114)
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
V_ESD
2000
V
I_S
−1.1
A
T_L
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size,
(30 mm², 2 oz Cu).
http://onsemi.com
V_(BR)DSS
−20 V
R_DS(on) MAX
18 mW @ −4.5 V
25 mW @ −2.5 V
50 mW @ −1.8 V
90 mW @ −1.5 V
S
I_D MAX
−8.2 A
G
S
Pin 1
D
P−CHANNEL MOSFET
D
WDFN6
CASE 506AP
MARKING
DIAGRAM
1
2
ACMG
6
5
3^G 4
AC = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
ORDERING INFORMATION
Device
Package
Shipping^†
NTLJS3A18PZTWG _WDFN6
NTLJS3A18PZTXG ^{(Pb−Free)}
10000/Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
1
November, 2012 − Rev. 0
Publication Order Number:
NTLJS3A18PZ/D