NTLJS1102P Datasheet, PDF (1/7 Pages) ON Semiconductor – Power MOSFET −8 V, −8.1 A, COOL Single P−Channel, 2x2 mm, WDFN package

NTLJS1102P
Power MOSFET
−8 V, −8.1 A, mCOOL] Single P−Channel,
2x2 mm, WDFN package
Features
• WDFN Package with Exposed Drain Pad for Excellent Thermal
Conduction
• Lowest RDS(on) in 2 x 2 mm Package
• 1.2 V RDS(on) Rating for Operation at Low Voltage Logic Level Gate
Drive
• 2 x 2 mm Footprint Same as SC−88 Package
• Low Profile (<0.8 mm) for Easy Fit in Thin Environments
• This is a Halide−Free Device
• This is a Pb−Free Device
Applications
• High Side Load Switch
• Li Ion Battery Linear Mode Charging
• Optimized for Battery and Load Management Applications in
Portable Equipment
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous
Drain Current
(Note 1)
Steady
State
tv5s
Power
Dissipation
(Note 1)
Steady
State
tv5s
T_A = 25°C
T_A = 85°C
T_A = 25°C
T_A = 25°C
V_DSS
V_GS
I_D
P_D
−8
V
±6
V
−6.2
−4.5
A
−8.1
1.9
W
3.3
Continuous
Drain Current
(Note 2)
Power
Dissipation
(Note 2)
Steady
State
T_A = 25°C
T_A = 85°C
T_A = 25°C
−3.7
I_D
A
−2.7
P_D
0.7
W
Pulsed Drain Current
t_p = 10 ms
Operating Junction and Storage
Temperature
I_DM
−30
A
T_J, T_STG −55 to °C
150
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
I_S
−5.5
A
T_L
260
°C
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface−mounted on FR4 board using the minimum recommended pad size
(Cu area = 30 mm² [2 oz] including traces).
http://onsemi.com
V_(BR)DSS
−8.0 V
R_DS(on) MAX
36 mW @ −4.5 V
45 mW @ −2.5 V
68 mW @ −1.8 V
90 mW @ −1.5 V
300 mW @ −1.2 V
I_D MAX
−6.2 A
−5.5 A
−3.0 A
−1.0 A
−0.2 A
S
G
S
Pin 1
D
P−CHANNEL MOSFET
D
WDFN6
CASE 506AP
MARKING
DIAGRAM
1
2
J6MG
6
5
3^G 4
J6 = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
D1
D2
G3
D
S
6D
5D
4S
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
1
November, 2008 − Rev. 0
Publication Order Number:
NTLJS1102P/D