NTLJD4150P_07 Datasheet, PDF (1/7 Pages) ON Semiconductor – Power MOSFET -30 V, -3.4 A, uCool TM Dual P-Channel,2x2 mm WDFN Package

NTLJD4150P
Power MOSFET
−30 V, −3.4 A, mCoolt Dual P−Channel,
2x2 mm WDFN Package
Features
• WDFN 2x2 mm Package Provides Exposed Drain Pad for
Excellent Thermal Conduction
• Footprint Same as SC−88 Package
• Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
• Bidirectional Current Flow with Common Source Configuration
• This is a Pb−Free Device
Applications
• Li−Ion Battery Charging and Protection Circuits
• LED Backlight, Flashlight
• Dual−High Side Load Switch
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
−30
V
Gate−to−Source Voltage
V_GS
±20
V
Continuous Drain Current _Steady T_A = 25°C
I_D
(Note 1)
State _{TA = 85°C}
−2.7 A
−2.0
t ≤ 5 s T_A = 25°C
−3.4
Power Dissipation
(Note 1)
Steady
P_D
State _{TA = 25°C}
t ≤5 s
1.5 W
2.3
Continuous Drain Current
T_A = 25°C
I_D
(Note 2)
Steady T_A = 85°C
Power Dissipation
(Note 2)
State
T_A = 25°C
P_D
−1.8 A
−1.4
0.7 W
Pulsed Drain Current
t_p = 10 ms
Operating Junction and Storage Temperature
I_DM
−14 A
T_J, −55 to °C
T_STG
150
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
I_S
−1.8 A
T_L
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size.
http://onsemi.com
V_(BR)DSS
−30 V
R_DS(on) Max
135 mW @ 10 V
200 mW @ 4.5 V
I_D Max (Note 1)
−3.4 A
S1
S2
G1
G2
D1
D2
P−CHANNEL MOSFET P−CHANNEL MOSFET
D2
D1
Pin 1
WDFN6
CASE 506AN
MARKING
DIAGRAM
1 _{JE M G} 6
2
3
G
5
4
JE
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
S1 ₁
D1
6 ^D1
G1 ₂
D2
D2 ₃
5 G2
4 _S2
(Top View)
ORDERING INFORMATION
Device
Package
Shipping^†
NTLJD4150PTBG WDFN6 3000 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D
© Semiconductor Components Industries, LLC, 2007
1
January, 2007 − Rev. 0
Publication Order Number:
NTLJD4150P/D