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NTLJD3119C Datasheet, PDF (1/10 Pages) ON Semiconductor – Power MOSFET 20 V/−20 V, 4.6 A/−4.1 A, uCool Complementary, 2x2 mm, WDFN Package | |||
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NTLJD3119C
Power MOSFET
20 V/â20 V, 4.6 A/â4.1 A, mCoolt
Complementary, 2x2 mm, WDFN Package
Features
⢠Complementary NâChannel and PâChannel MOSFET
⢠WDFN Package with Exposed Drain Pad for Excellent Thermal
Conduction
⢠Footprint Same as SCâ88 Package
⢠Leading Edge Trench Technology for Low On Resistance
⢠1.8 V Gate Threshold Voltage
⢠Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
⢠This is a PbâFree Device
Applications
⢠Synchronous DCâDC Conversion Circuits
⢠Load/Power Management of Portable Devices like PDAâs, Cellular
Phones and Hard Drives
⢠Color Display and Camera Flash Regulators
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
DrainâtoâSource Voltage
NâCh
VDSS
20
V
PâCh
â20
GateâtoâSource Voltage
NâCh
VGS
±8.0
V
PâCh
NâChannel
Continuous Drain
Current (Note 1)
PâChannel
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Steady TA = 25°C
ID
State TA = 85°C
t ⤠5 s TA = 25°C
Steady TA = 25°C
ID
State TA = 85°C
t ⤠5 s TA = 25°C
Steady
PD
State TA = 25°C
t â¤5 s
3.8
A
2.8
4.6
â3.3
A
â2.4
â4.1
1.5
W
2.3
NâChannel
Continuous Drain
Current (Note 2)
Steady TA = 25°C
ID
State TA = 85°C
2.6
A
1.9
PâChannel
Continuous Drain
Current (Note 2)
Steady TA = 25°C
ID
State TA = 85°C
â2.3
A
â1.6
Power Dissipation
(Note 2)
Steady
State
TA = 25°C
PD
0.71
W
Pulsed Drain Current NâCh tp = 10 ms
IDM
PâCh
18
A
â20
Operating Junction and Storage Temperature TJ, TSTG â55 to °C
150
Lead Temperature for Soldering Purposes
(1/8â³ from case for 10 s)
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size
of 30 mm2, 2 oz Cu.
© Semiconductor Components Industries, LLC, 2006
1
October, 2006 â Rev. 0
http://onsemi.com
V(BR)DSS
NâChannel
20 V
PâChannel
â20 V
RDS(on) MAX
65 mW @ 4.5 V
75 mW @ 2.5 V
120 mW @ 1.8 V
100 mW @ â4.5 V
135 mW @ â2.5 V
200 mW @ â1.8 V
ID MAX
3.8 A
2.0 A
1.7 A
â4.1 A
â2.0 A
â1.6 A
D2
Pin 1
MARKING
D1
DIAGRAM
WDFN6
CASE 506AN
1
2
3
JMMG
G
6
5
4
JD = Specific Device Code
M = Date Code
G = PbâFree Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
S1 1
D1
6 D1
G1 2
D2
D2 3
5 G2
4 S2
(Top View)
ORDERING INFORMATION
Device
Package
Shippingâ
NTLJD3119CTAG WDFN6 3000/Tape & Reel
(PbâFree)
NTLJD3119CTBG WDFN6 3000/Tape & Reel
(PbâFree)
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NTLJD3119C/D
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