NTLGF3402P Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET and Schottky Diode −20 V, −3.9 A FETKY, P−Channel, 2.0 A Schottky Barrier Diode, DFN6

NTLGF3402P
Power MOSFET and
Schottky Diode
−20 V, −3.9 A FETKY), P−Channel,
2.0 A Schottky Barrier Diode, DFN6
Features
• Flat Lead 6 Terminal Package 3x3x1 mm
• Enhanced Thermal Characteristics
• Low VF and Low Leakage Schottky Diode
• Reduced Gate Charge to Improve Switching Response
• This is a Pb−Free Device
Applications
• Buck Converter
• High Side DC−DC Conversion Circuits
• Power Management in Portable, HDD and Computing
MOSFET MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
−20
V
Gate−to−Source Voltage
V_GS
±12
V
Continuous Drain
Current (Note 1)
Steady ^{TA = 25°C}
I_D
State _{TA = 85°C}
−2.7
A
−2.0
t ≤ 10 s T_A = 25°C
−3.9
Power Dissipation
(Note 1)
Steady
P_D
State _{TA = 25°C}
t ≤ 10 s
1.6
W
3.0
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
T_A = 25°C
I_D
Steady T_A = 85°C
State
T_A = 25°C
P_D
−2.3
A
−1.7
1.14
W
Pulsed Drain Current
t_p = 10 ms
I_DM
11
A
Operating Junction and Storage Temperature T_J, T_STG −55 to °C
150
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
I_S
1.1
A
T_L
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size
(Cu area = 0.5 in sq).
http://onsemi.com
V_(BR)DSS
−20 V
MOSFET
R_DS(on) TYP
110 mW @ −4.5 V
I_D MAX
−3.9 A
V_R MAX
20 V
SCHOTTKY DIODE
V_F TYP
0.36 V
I_F MAX
2.0 A
25
123
3
Heatsink
1
4
6
654
1, 6 = Anode
2, 5 = Source
3 = Gate
4 = Drain/Cathode
MARKING
DIAGRAMS
1 3402
DFN6
AYWW
1
CASE 506AH
G
3402
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping^†
NTLGF3402PT1G ^DFN6 3000 / Tape & Reel
(Pb−Free)
NTLGF3402PT2G ^DFN6 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
1
March, 2006 − Rev. 1
Publication Order Number:
NTLGF3402P/D