NTK3142PT1G Datasheet, PDF (1/5 Pages) ON Semiconductor – Small Signal MOSFET −20 V, −280 mA, P−Channel with ESD Protection, SOT−723

NTK3142P
Small Signal MOSFET
−20 V, −280 mA, P−Channel with ESD
Protection, SOT−723
Features
• Enables High Density PCB Manufacturing
• 44% Smaller Footprint than SC−89 and 38% Thinner than SC−89
• Low Voltage Drive Makes this Device Ideal for Portable Equipment
• Low Threshold Levels, 1.8 V R_DS(on) Rating
• Low Profile (< 0.5 mm) Allows It to Fit Easily into Extremely Thin
Environments such as Portable Electronics
• Operated at Standard Logic Level Gate Drive, Facilitating Future
Migration to Lower Levels Using the Same Basic Topology.
• This is a Pb−Free Device
Applications
• Interfacing, Switching
• High Speed Switching
• Cellular Phones, PDA’s
http://onsemi.com
V_(BR)DSS
−20 V
R_DS(on) TYP
2.7 W @ −4.5 V
4.1 W @ −2.5 V
6.1 W @ −1.8 V
I_D Max
−280 mA
SOT−723 (3−LEAD)
3
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady
State
tv5s
Steady
State
tv5s
Steady
State
T_A = 25°C
T_A = 85°C
T_A = 25°C
T_A = 25°C
T_A = 25°C
T_A = 85°C
T_A = 25°C
V_DSS
V_GS
I_D
P_D
I_D
P_D
−20 V
±8.0 V
−260
−185 mA
−280
400
mW
500
−215
mA
−155
280 _mW
Pulsed Drain Current
t_p = 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I_DM
T_J,
T_STG
I_S
T_L
−310 mA
−55 to
150
°C
−240 mA
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in
sq [1 oz] including traces)
2. Surface−mounted on FR4 board using the minimum recommended pad size.
1
2
1 − Gate
2 − Source
3 − Drain
Top View
MARKING DIAGRAM
CASE 631AA
SOT−723
KB M
1
KB
= Specific Device Code
M
= Date Code
ORDERING INFORMATION
Device
Package
Shipping^†
NTK3142PT1G SOT−723 4000/Tape & Reel
(Pb−Free)
4 mm Pitch
NTK3142PT5G SOT−723 8000/Tape & Reel
(Pb−Free)
2 mm Pitch
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
1
November, 2009 − Rev. 2
Publication Order Number:
NTK3142P/D