NTJS3151P_16 Datasheet, PDF (1/5 Pages) ON Semiconductor – Trench Power MOSFET

NTJS3151P, NVJS3151P
Trench Power MOSFET
12 V, 3.3 A, Single P−Channel,
ESD Protected SC−88
Features
• Leading Trench Technology for Low R_DS(ON) Extending Battery Life
• SC−88 Small Outline (2x2 mm, SC70−6 Equivalent)
• Gate Diodes for ESD Protection
• NV Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• High Side Load Switch
• Cell Phones, Computing, Digital Cameras, MP3s and PDAs
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value Units
Drain−to−Source Voltage
V_DSS
−12
V
Gate−to−Source Voltage
V_GS
±12
V
Continuous Drain
Current (Note 1)
Steady T_A = 25 °C
I_D
State
T_A = 85 °C
−2.7
A
−2.0
t ≤ 5 s T_A = 25 °C
−3.3
Power Dissipation
(Note 1)
Steady T_A = 25 °C P_D
State
0.625 W
Pulsed Drain Current
t_p = 10 ms
I_DM
−8.0
A
Operating Junction and Storage Temperature
T_J,
−55 to _°C
T_STG
150
Source Current (Body Diode)
I_S
−0.8
A
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T_L
260
°C
THERMAL RESISTANCE RATINGS (Note 1)
Parameter
Symbol Max Units
Junction−to−Ambient – Steady State
R_qJA
200 °C/W
Junction−to−Ambient − t ≤ 5 s
R_qJA
141
Junction−to−Lead – Steady State
R_qJL
102
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
www.onsemi.com
V_(BR)DSS
−12 V
R_DS(on) Typ
45 mW @ −4.5 V
67 mW @ −2.5 V
133 mW @ −1.8 V
I_D Max
−3.3 A
SC−88 (SOT−363)
D
1
6
D
D
2
5
D
G
3
4
S
Top View
D
3 kW
G
S
MARKING DIAGRAM &
PIN ASSIGNMENT
DDS
1
SC−88/SOT−363
CASE 419B
STYLE 28
6
XXX MG
G
1
DDG
XXX
M
G
= Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
1
June, 2016 − Rev. 4
Publication Order Number:
NTJS3151/D