NTJD5121N Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET 60 V, 295 mA, Dual N-Channel with ESD Protection, SC-88

NTJD5121N
Power MOSFET
60 V, 295 mA, Dual N-Channel with ESD
Protection, SC-88
Features
•ăLow R_DS(on)
•ăLow Gate Threshold
•ăLow Input Capacitance
•ăESD Protected Gate
•ăThis is a Pb-Free Device
Applications
•ăLow Side Load Switch
•ăDC-DC Converters (Buck and Boost Circuits)
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value Units
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Steady T_A = 25°C
State
T_A = 85°C
t ≤ 5 s T_A = 25°C
T_A = 85°C
Steady T_A = 25°C
State
V_DSS
V_GS
I_D
P_D
60
V
±20
V
295 mA
212
304
219
250 mW
t≤5s
266
Pulsed Drain Current
t_p = 10 ms
I_DM
900 mA
Operating Junction and Storage Temperature T_J, T_STG -55 to _°C
150
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I_S
210 mA
T_L
260
°C
Gate-Source ESD Rating
(HBM, Method 3015)
ESD
1400 V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE RATINGS
Parameter
Symbol Value Units
Junction-to-Ambient – Steady State
R_qJA
Junction-to-Ambient – t ≤ 5 s
R_qJA
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [2 oz] including traces).
500 °C/W
470
http://onsemi.com
V_(BR)DSS
60 V
R_DS(on) MAX
1.6 W @ 10 V
2.5 W @ 4.5 V
I_D Max
295 mA
SC-88 (SOT-363)
S₁
1
6
D₁
G₁
2
5
G₂
D₂
3
4
S₂
Top View
MARKING DIAGRAM &
PIN ASSIGNMENT
D1 G2 S2
1
SC-88/SOT-363
CASE 419B
STYLE 26
6
TF MĂG
G
1
S1 G1 D2
TF
= Device Code
M
= Date Code
G
= Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
NTJD5121NT1G SC-88 3000 / Tape & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2008
1
April, 2008 - Rev. 1
Publication Order Number:
NTJD5121N/D