NTJD4158C Datasheet, PDF (1/7 Pages) ON Semiconductor – Small Signal MOSFET 30 V/−20 V, +0.25/−0.88 A, Complementary, SC−88

NTJD4158C
Small Signal MOSFET
30 V/−20 V, +0.25/−0.88 A,
Complementary, SC−88
Features
• Leading 20 V Trench for Low R_DS(on) Performance
• ESD Protected Gate
• SC−88 Package for Small Footprint (2 x 2 mm)
• This is a Pb−Free Device
Applications
• DC−DC Conversion
• Load/Power Management
• Load Switch
• Cell Phones, MP3s, Digital Cameras, PDAs
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
N−Ch
V_DSS
30
V
P−Ch
−20
Gate−to−Source Voltage
N−Ch
V_GS
±20
V
P−Ch
±12
N−Channel
Continuous Drain
Current (Note 1)
Steady
T_A = 25°C
I_D
State
T_A = 85°C
0.25
A
0.18
P−Channel
Continuous Drain
Current (Note 1)
Steady
State
T_A = 25°C
T_A = 85°C
−0.88
−0.63
Power Dissipation
(Note 1)
Steady
State
T_A = 25°C
P_D
0.27 W
Pulsed Drain Cur-
rent
N−Ch
I_DM
tp = 10 ms
P−Ch
0.5
A
−3.0
Operating Junction and Storage Temperature T_J, T_stg −55 to °C
150
Source Current (Body Diode)
N−Ch
P−Ch
I_S
0.25
A
−0.48
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T_L
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Ambient – Steady State (Note 1)
R_qJA
460 °C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
http://onsemi.com
V_(BR)DSS
N−Ch
30 V
P−Ch
−20 V
R_DS(on) Typ
1.0 W @ 4.5 V
1.5 W @ 2.5 V
215 mW @ −4.5 V
345 mW @ −2.5 V
I_D Max
0.25 A
−0.88 A
SC−88 (SOT−363)
(6−Leads)
S₁
1
6
D₁
G₁
2
5
G₂
D₂
3
4
S₂
(Top View)
1
SC−88 (SOT−363)
CASE 419B
STYLE 26
MARKING DIAGRAM &
PIN ASSIGNMENT
D1 G2 S2
6
TCD M G
G
1
S1 G1 D2
TCD
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NTJD4158CT1G SC−88 3000 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
1
March, 2009 − Rev. 2
Publication Order Number:
NTJD4158C/D