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NTJD4152P_15 Datasheet, PDF (1/5 Pages) ON Semiconductor – Trench Small Signal MOSFET
NTJD4152P, NVJD4152P
Trench Small Signal
MOSFET
20 V, 0.88 A, Dual P−Channel,
ESD Protected SC−88
Features
• Leading Trench Technology for Low RDS(ON) Performance
• Small Footprint Package (SC70−6 Equivalent)
• ESD Protected Gate
• NV Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These are Pb−Free Devices
Applications
• Load/Power Management
• Charging Circuits
• Load Switching
• Cell Phones, Computing, Digital Cameras, MP3s and PDAs
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
VDSS
−20
V
Gate−to−Source Voltage
VGS
±12
V
Continuous Drain
Current (Note 1)
Steady TA = 25°C
ID
State TA = 85°C
−0.88 A
−0.63
Power Dissipation
(Note 1)
Steady TA = 25°C
PD
State TA = 85°C
0.272 W
0.141
Continuous Drain
Current (Note 2)
t v 5 s TA = 25°C
ID
TA = 85°C
−1.0
A
−0.72
Power Dissipation
(Note 2)
t v 5 s TA = 25°C
PD
TA = 85°C
0.35 W
0.181
Pulsed Drain Current
t ≤ 10 ms
IDM
±3.0
A
Operating Junction and Storage Temperature
TJ,
−55 to °C
TSTG
150
Continuous Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
IS
−0.48 A
TL
260
°C
THERMAL RESISTANCE RATINGS (Note 1)
Parameter
Symbol Max Unit
Junction−to−Ambient – Steady State
RqJA 460 °C/W
Junction−to−Ambient − t v 5 s
RqJA 357
Junction−to−Lead – Steady State
RqJL
226
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces), steady state.
2. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces), t v 5 s.
www.onsemi.com
V(BR)DSS
−20 V
RDS(on) Typ
215 mW @ −4.5 V
345 mW @ −2.5 V
600 mW @ −1.8 V
ID Max
−0.88 A
S1
1
6
D1
G1
2
5
G2
D2
3
4
S2
Top View
MARKING DIAGRAM &
PIN ASSIGNMENT
1
SC−88/SOT−363
CASE 419B
STYLE 26
D1 G2 S2
6
XXX MG
G
1
S1 G1 D2
XXX
M
G
= Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
1
February, 2015 − Rev. 6
Publication Order Number:
NTJD4152P/D