NTJD4152P Datasheet, PDF (1/5 Pages) ON Semiconductor – Trench Small Signal MOSFET 20 V, 0.88 A, Dual P-Channel, ESD Protected SC-88

NTJD4152P
Trench Small Signal
MOSFET
20 V, 0.88 A, Dual P-Channel,
ESD Protected SC-88
Features
•ăLeading Trench Technology for Low R_DS(ON) Performance
•ăSmall Footprint Package (SC70-6 Equivalent)
•ăESD Protected Gate
•ăPb-Free Package is Available
Applications
•ăLoad/Power Management
•ăCharging Circuits
•ăLoad Switching
•ăCell Phones, Computing, Digital Cameras, MP3s and PDAs
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain-to-Source Voltage
V_DSS
-20
V
Gate-to-Source Voltage
V_GS
±12
V
Continuous Drain
Current (Note 1)
Steady T_A = 25°C
I_D
State _{TA = 85°C}
-0.88 A
-0.63
Power Dissipation
(Note 1)
Steady T_A = 25°C
P_D
State
T_A = 85°C
0.272 W
0.141
Continuous Drain
Current (Note 2)
t v 5 s T_A = 25°C
I_D
T_A = 85°C
-1.0
A
-0.72
Power Dissipation
(Note 2)
t v 5 s T_A = 25°C
P_D
T_A = 85°C
0.35 W
0.181
Pulsed Drain Current
t ≤ 10 ms
I_DM
±3.0
A
Operating Junction and Storage Temperature
T_J,
-55 to _°C
T_STG
150
Continuous Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I_S
-0.48 A
T_L
260
°C
THERMAL RESISTANCE RATINGS (Note 1)
Parameter
Symbol Max Unit
Junction-to-Ambient – Steady State
R_qJA 460 °C/W
Junction-to-Ambient - t v 5 s
R_qJA
357
Junction-to-Lead – Steady State
R_qJL
226
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces), steady state.
2. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces), t v 5 s.
http://onsemi.com
V_(BR)DSS
-20 V
R_DS(on) Typ
215 mW @ -4.5 V
345 mW @ -2.5 V
600 mW @ -1.8 V
I_D Max
-0.88 A
S₁
1
6
D₁
G₁
2
5
G₂
D₂
3
4
S₂
Top View
MARKING DIAGRAM &
PIN ASSIGNMENT
D1 G2 S2
1
SC-88/SOT-363
CASE 419B
STYLE 28
6
TK MĂG
G
1
S1 G1 D2
TK
= Device Code
M
= Date Code
G
= Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping
NTJD4152PT1 SOT-363 3000 Units/Reel
NTJD4152PT1G ^SOT-363 3000 Units/Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2007
1
August, 2007 - Rev. 2
Publication Order Number:
NTJD4152/D