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NTJD2152P_06 Datasheet, PDF (1/6 Pages) ON Semiconductor – Trench Small Signal MOSFET
NTJD2152P
Trench Small Signal
MOSFET
8 V, Dual P−Channel, SC−88
ESD Protection
Features
• Leading –8 V Trench for Low RDS(ON) Performance
• ESD Protected Gate
• Small Footprint (2 x 2 mm)
• Same Package as SC−70−6
• Pb−Free Packages are Available
Applications
• Load Power switching
• DC−DC Conversion
• Li−Ion Battery Charging Circuits
• Cell Phones, Media Players, Digital Cameras, PDAs
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
VDSS
−8.0
V
Gate−to−Source Voltage
VGS
±8.0
V
Continuous Drain
Current
(Based on RqJA)
Steady TA = 25 °C
ID
−0.775 A
State
TA = 85 °C
−0.558
Power Dissipation
(Based on RqJA)
Steady TA = 25 °C PD
State
TA = 85 °C
0.27 W
0.14
Continuous Drain
Current
(Based on RqJL)
Steady TA = 25 °C
ID
State
TA = 85 °C
−1.1
A
−0.8
Power Dissipation
(Based on RqJL)
Steady TA = 25 °C
State
TA = 85 °C
PD
0.55 W
0.29
Pulsed Drain Current
t ≤10 ms
IDM
±1.2
A
Operating Junction and Storage Temperature
TJ,
−55 to °C
TSTG
150
Continuous Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
IS
−0.775 A
TL
260
°C
THERMAL RESISTANCE RATINGS (Note 1)
Parameter
Symbol Typ Max Unit
Junction−to−Ambient – Steady State
RqJA 400 460 °C/W
Junction−to−Lead (Drain) – Steady State RqJL 194 226
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 oz Cu area = 0.9523 in sq.
http://onsemi.com
V(BR)DSS
−8 V
RDS(on) TYP
0.22 W @ −4.5 V
0.32 W @ −2.5 V
0.51 W @ −1.8 V
ID Max
−0.775 A
SOT−363
SC−88 (6 LEADS)
S1
1
6
D1
G1
2
5
G2
D2
3
4
S2
Top View
MARKING DIAGRAM &
PIN ASSIGNMENT
D1 G2 S2
1
SC−88/SOT−363
CASE 419B
STYLE 28
6
TA M G
G
1
S1 G1 D2
TA
= Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
1
March, 2006 − Rev. 3
Publication Order Number:
NTJD2152/D