NTHS4166N Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 30 V, 8.2 A, Single N-Channel, ChipFET Package

NTHS4166N
Power MOSFET
30 V, 8.2 A, Single N-Channel,
ChipFETt Package
Features
•ăTrench Technology
•ăLow R_DS(on) to Minimize Conduction Losses
•ăLeadless ChipFET Package has 40% Smaller Footprint than TSOP-6
•ăExcellent Thermal Capabilities
•ăThis is a Pb-Free Device
Applications
•ăLoad Switching
•ăDC-DC Converters
•ăLow Side Switching
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain-to-Source Voltage
V_DSS
30
V
Gate-to-Source Voltage
V_GS
±20
V
Continuous Drain
Current R_qJA (Note 1)
T_A = 25°C
I_D
T_A = 85°C
6.6
A
4.8
Power Dissipation
R_qJA (Note 1)
T_A = 25°C
P_D
Steady
Continuous Drain
State _{TA = 25°C}
I_D
Current R_qJA (Note 2)
T_A = 85°C
1.5
W
4.9
A
3.6
Power Dissipation
R_qJA (Note 2)
T_A = 25°C
P_D
0.8
W
Continuous Drain
T_A = 25°C
I_D
Current R_qJA, t v 5 s
(Note 1)
Steady T_A = 85°C
State
Power Dissipation
T_A = 25°C
P_D
R_qJA (Note 1)
8.2
A
5.9
2.2
W
Pulsed Drain Current TA = 25°C,
t_p = 10 ms
I_DM
32
A
Operating Junction and Storage Temperature T_J,
-55 to °C
T_STG
150
Source Current (Body Diode) R_qJF
I_S
2.6
A
Single Pulse Drain-to-Source Avalanche
EAS
20
mJ
Energy T_J = 25°C, V_DD = 50 V, V_GS = 10 V,
I_L = 20 A_pk, L = 0.1 mH, R_G = 25 W
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T_L
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq. pad, 1 oz Cu.
2. Surface Mounted on FR4 Board using the minimum recommended pad size.
http://onsemi.com
V_(BR)DSS
30 V
R_DS(on) Max
22 mW @ 10 V
27 mW @ 4.5 V
D
I_D Max
8.2 A
G
S
N-Channel MOSFET
MARKING DIAGRAM
AND PIN ASSIGNMENT
8
D DDS
1
ChipFET
CASE 1206A
STYLE 1
466 M
G
1
D DDG
466 = Specific Device Code
M = Month Code
G = Pb-Free Package
ORDERING INFORMATION
Device
Package
Shipping^†
NTHS4166NT1G ChipFET 3000/Tape & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2007
1
December, 2007 - Rev. 0
Publication Order Number:
NTHS4166N/D